ThomasNet News Logo
Sign Up | Log In | ThomasNet Home | Promote Your Business
 Journals
Industry Market Trends ®
IMT Career Journal
IMT Fluid & Gas Flow Journal
IMT Green & Clean Journal
IMT Machining Journal
IMT Procurement Journal
 Industry News
Latest New Product News
Association & Government News
 Product News
Adhesives and Sealants
Agricultural and Farming Products
Architectural and Civil Engineering Products
Automatic ID
Chemical Processing and Waste Management
Cleaning Products and Equipment
Communication Systems and Equipment
Computer Hardware and Peripherals
Construction Equipment and Supplies
Controls and Controllers
Display and Presentation Equipment
Electrical Equipment and Systems
Electronic Components and Devices
Explosives, Armaments and Weaponry
Fasteners and Hardware
Fluid and Gas Flow Equipment
Food Processing and Preparation
Green & Clean
Health, Medical and Dental Supplies and Equipment
HVAC
Labels, Tags, Signage and Equipment
Laboratory and Research Supplies and Equipment
Lubricants
Machinery and Machining Tools
Material Handling and Storage
Materials and Material Processing
Mechanical Components and Assemblies
Mechanical Power Transmission
Mining, Oil Drilling & Refining
Mounting and Attaching Products
Non-Industrial Products
Optics and Photonics
Packaging Products & Equipment
Paints and Coatings
Plant Furnishings and Accessories
Portable Tools
Printing and Duplicating Equipment
Retail and Sales Equipment
Robotics
Safety and Security Equipment
Sensors, Monitors and Transducers
Services
Software
Test and Measuring Instruments
Textile Industry Products
Thermal and Heating Equipment
Timers and Clocks
Transportation Industry Products
Vision Systems
Waste Handling Equipment
Welding Equipment and Supplies
 Press Releases
Products in the News
Company News
Mergers & Acquisitions
People in the News
Literature & Websites
 Resources
News Delivery Options
FABTECH
Society of Manufacturing Engineers
Browse Categories
Browse Companies
Mobile Edition
PR Resources
Licensing
Advertising
How to Write an effective Press Release
Trade Associations
Small Business Support
MEP
congatec AG
Auwiesenstr. 5
Deggendorf, Germany

Detailed Contact Information:
COM Express Type 6 Module features quad core processors.   Return to story
Company Information:
congatec AG
Auwiesenstr. 5
Deggendorf  Germany
Phone: +49 (991) 2700-0
http://www.congatec.com
Public Relations:
Wendy Truax
USA
Phone: 503-351-0103
FAX: 503-788-2621
 
 
Latest New Product News from congatec AG
Products or services this company supplies:
 
Click links to find other companies which supply the same products or services.

COM Express Compact Module features quad-core processor.

congatec AG    Deggendorf,
May 03, 2013 Suitable for visualization and control applications, conga-TCG is available with 4 processors from AMD Embedded G-Series SOC platform, ranging from 1.0 GHz dual-core AMD GX-210HA with 1 MB shared L2 cache and 9 W TDP to 2.0 GHz quad-core AMD GX-420CA with 2 MB shared L2 cache and 25 W TDP. Integrated AMD Radeon™ graphics feature Universal Video Decoder 4.2 for seamless processing of BluRays. Interface options include VGA, Single/Dual channel 18/24-bit LVDS, DisplayPort 1.2, and DVI/HDMI 1.4a.

Computer Module supports WEC7 multimedia applications.

congatec AG    Deggendorf,
Mar 07, 2013 Based on Freescale i.MX6 ARM Cortex A9 processor, conga-QMX6 Qseven Module is available in Windows® Embedded Compact v7. WEC7 provides 32-bit hard real-time operating system with Silverlight support, customizable user interface, multimedia player, and Internet Explorer with Flash 10.1. Equipped with 3D-capable HD graphics interface, conga-QMX6 targets manufacturers of mobile and ultra mobile industrial devices as well as medical, automotive, and industrial automation applications.

Starter Kit supports battery-powered embedded systems.

congatec AG    Deggendorf,
Mar 07, 2013 Offering complete starter package for rapid prototyping of battery-powered embedded systems, Qseven Mobility Kit comprises Qseven carrier board, 7 in. LVDS single touch display with LED backlight, battery manager, and smart battery module. Carrier board, measuring 95 x 145 mm, includes 6 USB ports, Ethernet port, LVDS and DVI interfaces, Mini PCI Express slot, and HD audio interface. Due to 5 V power supply of Qseven module, battery system can be implemented using small, dual-cell smart batteries.

COM Express Modules utilize 3rd Gen Intel® Core(TM) technology.

congatec AG    Deggendorf,
Mar 01, 2013 Equipped with Intel HM76 Express Chipset, conga-TS77 and conga-BS77 are available with 2.20 GHz dual-core Intel® Celeron® Processor 1020E, 1.40 GHz dual-core Intel Celeron Processor 1047UE, or 1.50 GHz single-core Intel Celeron Processor 927UE. Modules offer up to 16 GB of dual-channel DDR3 memory plus direct support for USB 3.0 and Intel Hyper-Threading Technology. Additional features include 7 PCI Express 2.0 lanes, PCI Express Graphics 3.0 x 16 lanes, 4 SATA ports, and 1 Gb Ethernet interface.

Embedded Computer Modules help users create ARM-based designs.

congatec AG    Deggendorf,
Dec 05, 2012 Providing developers with complete package to rapidly prototype embedded systems for ARM designs, Qseven Starter Kit is equipped with conga-QMX6 Qseven module, based on Freescale i.MX6 ARM Cortex A9 processor, with 3D-capable HD graphics interface. Kit also includes conga-QEVAL evaluation carrier board, which provides 5 USB ports, Gigabit Ethernet port, HDMI, 18/24 bit LVDS, and PCI Express socket. For connection of mass storage devices, 1x SATA and SD card are integrated on baseboard.

COM Express Module supports PCI Express graphics.

congatec AG    Deggendorf,
Aug 13, 2012 Based on COM Express Type 2 connector pin-out, conga-BP77 is available with Intel® Core(TM) i7-3612QE, i7-3555LE, and i5-3610ME processors. Module features mobile Intel® Express chip set QM77 and offers up to 16 GB dual channel DDR3 memory. Six PCI Express 2.0 lanes, 4 SATA interfaces with up to 6 GBps and RAID support, 8 USB 2.0 ports, 1 EIDE, and 1 Gigabit Ethernet interface facilitate system extensions. Besides PEG 3.0, module supports VGA and LVDS, DirectX 11, OpenGL 3.1, and OpenCL 1.1.

COM Express Type 6 Module leverages AMD embedded R-Series APU.

congatec AG    Deggendorf,
Jun 11, 2012 Based on Type 6 pinout, conga-TFS enables multimedia advancements and optimized visual experience. Integration of AMD Embedded R-Series APU expands COM Express standard with module that combines x86 processing, integrated graphics, and parallel processing support. AMD A70M Controller Hub is used to deliver compact, 2-chip solution with support for up to 16 GB dual-channel 1,600 MHz DDR3 memory. Diverse range of integrated graphics, expansion, and I/O capabilities is standard.

COM Express Type 6 Module features quad core processors.

congatec AG    Deggendorf,
May 02, 2012 Built on 22 nm technology, conga-TM77 is fitted with 3rd generation Intel® Core(TM) i7-3612QE and Intel® Core(TM) i7-3615QE processors along with Mobile Intel® HM76 Express chipset. Unit provides native USB 3.0 support and up to 16 GB dual-channel DDR3-1600 MHz memory. Equipped with over 16 execution units, integrated Intel® HD4000 graphics core can control up to 3 displays independently. Additional features include 7 PCIe 2.0 lanes and 4 SATA interfaces with up to 6 GBps and RAID support.

Computer-on-Module features Qseven form factor.

congatec AG    Deggendorf,
Mar 09, 2012 Equipped with 1 of 4 Freescale i.MX6 ARM Cortex A9 processors which are scalable from 1-4 cores, conga-QMX6 features low power dissipation of less than 5 W. Integrated graphics core is designed for multimedia applications with video processor unit, 2D and 3D graphics, 4 shaders with up to 200 MT/sec, and dual stream of 1,080p/720p. Dual HDMI v1.4 graphics interface is available, with second HDMI port shared with LVDS. MicroSD socket is available for mass storage.

COM Express Cooling System ensures maximum COM performance. .

congatec AG    Deggendorf,
Mar 08, 2012 Based on cooling pipes which are integrated in standardized heatspreader of COM Express specification, Cooling System makes it possible to cool next generation processors with power dissipation of well over 35 W thermal design power (TDP). Design is available in different variants comprising passive, active, and customer-specific solutions. By eliminating mechanical stress, cooling system optimizes quality and extends life span of module.


Click below for more Product News from congatec AG

Next News Stories



Other Company News From congatec AG

Feb 26, 2013

Qseven Tablet PC Demonstration Platform Heralds New Age of Flexible Design


Nov 20, 2012

Congatec Enters Software Partnership with Adeneo Embedded to Offer BSPs for ARM Modules


Feb 13, 2012

AMD Fusion-Based Congatec COMs Support OpenCL for Flexible Task Distribution


Dec 13, 2011

Congatec Cooperates with Freescale to Broaden Future Selection of Computer-on-Modules


Apr 11, 2011

congatec AG Appoints Avnet Embedded as New Sales Partner for UK, Nordic and Baltic Markets


Mar 31, 2011

congatec Achieves New Record of $64 Million in 2010


Jun 07, 2006

Advantech, Ampro and Congatec Announce New XTX Alliance


Apr 27, 2006

The Toolbox Needed for an XTX Quickstart is Packed and Ready to Go - An Engineering Head Start is Offered by the Congatec XTX Starterkit


Nov 28, 2005

First COM Express Compact Computer Module - Congatec AG Announces the Conga-CLX, the First Embedded Computer Module Utilizing the Miniaturized COM Express Compact Standard


Nov 28, 2005

XTX Module Based on Intel 915 Chipset is Now Available - The Conga-X915 Supports all the Features Ddefined by the XTX Standard






Home  |  My ThomasNet News®  |  Industry Market Trends®  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2013 Thomas Publishing Company. All Rights Reserved.
Terms of Use - Privacy Policy