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Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at 2014 OFC/NFOEC

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Vishay

63 Lincoln Hwy., P.O. Box 4004, Malvern, PA, 19355, USA

Original Press Release

Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at 2014 OFC/NFOEC

Press release date: February 27, 2014

Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products

MALVERN, Pa. – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2014 Optical Fiber Communications Conference and Exhibition/National Fiber Optic Engineers Conference (OFC/NFOEC), taking place March 9-13 at the Moscone Center in San Francisco. In booth 3482, products on display will include a wide range of Vishay EFI custom submounts, custom substrates with sidewall patterning, high-performance RF capacitors, and wire-bondable products.

Featured submounts at the 2014 OFC/NFOEC will include Vishay EFI's AlN (aluminum nitride), BeO (beryllium oxide), and Al203 (aluminum oxide) ceramic substrates, which offer copper-filled vias, thick copper traces, and laser-machined shapes. For bonding, gold/tin solder features 70/30 to 80/20 compositions and thickness from 2 µm to 8 µm. Also on display will be Vishay EFI's custom substrates with sidewall patterning. Ideal for high-frequency circuits in RF applications and high-bit-rate transceivers, the substrates feature a plate thickness ≤ 0.025 inches, minimum gap of 0.003 inches, and are available in a variety of metal systems.

For impedance matching circuits, decoupling, DC blocking, and lumped element filters, Vishay EFI will be highlighting its RFCS surface-mount thin film RF capacitors. The devices feature capacitance from 0.2 pF to 27 pF, low DCR, and high Q and SRF. Highlighted wire-bondable products will include resistors with TCR to ± 25 ppm/°C and power ratings to 1 W; resistor networks with tolerances to 0.05 %; single and binary capacitors; and inductors with inductance from 3 nH to 150 nH.

The OFC/NFOEC is the largest global conference and exposition for optical communications and networking professionals. More information on the event is available at http://www.ofcnfoec.org.

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay's product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

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Vishay Contact:
Andrew Post
Senior Manager
Global Communications
Vishay Intertechnology, Inc.
Telephone: 1-610-251-5287
Fax: 1-610-889-9429
Email: andrew.post@vishay.com

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