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Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at IPC Midwest 2012

Original Press Release

Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at IPC Midwest 2012

Press release date: July 1, 2012

Duluth, GA - Viscom will exhibit in Booth #403 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. Viscom's automatic optical inspection (AOI) systems are used for both high-volume production lines and small series and prototype production. The S2088-II desktop system uses the same camera technology as the inline high-speed systems with high resolution on demand and angular view capability. A special highlight from Viscom's X-ray product range is the system family for combined AOI/AXI inspection of printed circuit boards (PCBs) populated on one or both sides. These systems combine a time-proven visible light inspection with the benefits of microfocus X-ray inspection. Also highlighted at the show, Viscom's new SPI-AOI Uplink feature enables the use of information later in the process to ensure post-reflow defect detection while allowing high variability of the paste print process. SPI measurement data is used not only to classify paste print but also to provide the information to the post-reflow AOI inspection via Viscom's unique SPI-AOI Uplink interface.

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