TI's Hollywood(TM) Mobile Digital TV Chip Makes Worldwide Premiere


Industry's First Single-Chip Mobile TV Solution Makes Broadcast TV on Mass Market Mobile Phones Practical for Manufacturers

DALLAS, Jan. 4 -- Broadcast digital TV can now be delivered into the cell phones of millions of consumers worldwide while maintaining low cost, long battery life and attractive phone size. Texas Instruments Incorporated (NYSE:TXN) (TI) today announced that initial Hollywood(TM) DTV single-chip solutions for mobile phones are now being delivered to TI's customers who manufacture handsets worldwide. TI's Hollywood chips are the first in the industry to integrate the mobile TV tuner and demodulator into one piece of silicon using standard 90 nanometer digital process. Consumers should expect to find the first mobile phones with TI's Hollywood chips inside on the market in late 2006.

"We've moved aggressively to provide consumers with the ability to experience Hollywood in the palm of their hands. The Hollywood design team has made an extraordinary achievement -- in less than three days the team was able to get initial silicon working and receiving digital TV content," said Gilles Delfassy, TI senior vice president and general manager for TI's Wireless Terminals Business Unit. "Mobile TV is expected to boost 3G adoption, much like camera phones did for the 2.5G market and add significant new revenue to both television broadcasters and mobile phone operators."

"Broadcast TV to the mobile phone is starting to find market traction worldwide; in order to integrate this function in the cellular handset, the solution needs to be small in form factor, low in power consumption, and low in cost. Typically TV functionality necessitates 3 individual chips to handle the RF, baseband, and memory portions; but the three constraints mentioned suggest that, vendors that offer an integrated single-chip solution will allow their handset partners a market-leading advantage," said Alan Varghese, principal analyst at ABI Research.

TI's first two products in the Hollywood mobile DTV family are the DTV1000 and the DTV1001. As complete solutions, both chips enable mobile TV handsets and services to reach the mass market quickly and at a lower cost to consumers (see: www.ti.com/hollywoodpr ). Hollywood chips support open industry standards, addressing the requirements of customers around the globe. Primary standard support includes DVB-H which is being deployed world-wide including Europe, the U.S. and parts of Asia, and ISDB-T which is being deployed in Japan. DVB-H and ISDB-T use OFDM (orthogonal frequency division multiplexing) technology which provides good spectral efficiency and immunity to multi-path to offer improved mobile TV performance.

In addition, both the DTV1000 and the DTV1001 chips interface with TI's family of OMAP(TM) applications processors to deliver crisp, clear video and stereo audio, offering consumers the quality of a living room TV-viewing experience in the palm of their hand.

"Modeo(TM) congratulates TI on its continued development of its Hollywood product line, which signals a deep commitment to the mobile television market and is expected to provide a high performance, low cost solution for use in the delivery of quality mobile television and audio content to mobile devices," commented Michael Schueppert, president of Modeo LLC ("Modeo"), formerly known as Crown Castle Mobile Media LLC.

TI's Hollywood Mobile Broadcast Single-Chip Solutions

The DTV1000 supports DVB-H operating at 470-750 MHz (UHF) and 1.670-1.675 GHz (L-band) frequency ranges, while the DTV1001 supports ISDB-T one-segment operating at 470-770 MHz frequency range. Through TI's innovative DRP(TM) technology, the Hollywood devices combine a two-chip or system in package (SIP) solution into a single piece of silicon in standard 90 nanometer digital process to deliver:

-- Smallest board area: High degree of integration and low ball count has lead to a footprint of less than 1cm squared for the entire solution including all passive and power switch components which is significantly smaller than current solutions that require a separate tuner, demodulator and external memory.

-- Very low power: Low 1 volt RF CMOS process and low power design techniques have resulted in only 30mW of power consumption for a typical category B DVB-H terminal. Combined with TI's low power OMAP application processors this can deliver four to seven hours of view time depending on display size and battery rating.

-- Fast Time to Market: Significant value-added processing in the DTV100X results in a simple software driver and API package accelerating integration with host processors, such as OMAP applications processors, and reducing time to market.

-- High Performance: Multiple concurrent television channels (elementary streams) can be supported and fast channel switching times under 1.5 seconds are possible.

-- Low Part Count and Lower Bill of Materials: High integration has lead to a small number of low cost external components driving the estimated bill of materials in volume under $10.

Texas Instruments -- Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 16 years of wireless systems expertise that spans handsets and base stations for all communications standards, Wireless LAN, A-GPS, Mobile TV, Bluetooth(R) and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit www.ti.com/wirelesspressroom for additional information.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com/ .

Trademarks

Hollywood, DRP and OMAP are trademarks of Texas Instruments. Modeo is a trademark owned by Modeo LLC. All other trademarks and registered trademarks are property of their respective owners.

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