TI Announces Free Windows Embedded CE 6.0 R3 Board Support Packages (BSPs) for OMAP-L1x and Sitara(TM) AM1x Devices, Reducing Development Time and Costs
Provides clean source code for customers whose operating system of choice is Windows Embedded CE 6.0 R3
DALLAS -- Texas Instruments Incorporated (TI) (NYSE: TXN) introduces Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9(TM) processors, Sitara(TM) AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). The BSPs include well-tested drivers and source code, enabling developers to easily and quickly interface the supported devices to the operating system. They provide drivers and protocol stacks necessary for many of the chips' integrated peripherals, such as Ethernet, USB, CAN, SATA, LCD and touch screen controllers. Additionally for OMAP-L1x devices, the BSP provides access to TI's(TM)S320C674x(TM) DSP using DSP/BIOS(TM) Link inter-processor communication software. DSP/BIOS Link enables developers to easily access the DSP for algorithm development using Windows Embedded CE 6.0 R3. For more information or to download these BSPs, visit www.ti.com/wincebsp-prtf.
The OMAP-L1x and AM1x board support packages are compatible with the following TI processors and associated EVMs:
o OMAP-L137 processor
o OMAP-L138 processor
o AM1707 microprocessor
o AM1808 microprocessor
o AM17x Evaluation Module
o AM18x Evaluation Module
o AM18x Experimenter's Kit
o OMAPL137/C6747 Floating Point Starter Kit
o OMAP-L138/(TM)S320C6748 EVM
o OMAP-L138 Experimenter Kit
Windows Embedded CE 6.0 R3 provides developers with the tools and technologies to deliver differentiated devices with immersive user experiences and streamlined connectivity to Windows-based PCs, servers and online services. Building on its reputation for flexible software solutions, TI is expanding its list of product lines already supported by Windows CE BSPs, including Sitara AM3517 and AM3505 MPUs, DaVinci(TM) DM644x video processors and several OMAP35x devices. For more information or to download CE BSPs for other TI devices, visit www.ti.com/wincebsp-prlp.
Microsoft is excited to be collaborating with TI on its BSPs for Windows Embedded CE 6.0 R3, helping developers increase efficiency when building devices with OMAP-L1x and Sitara AM1x," said Kim Chau, senior partner manager for Windows Embedded. "Windows Embedded CE 6.0 R3 drives rich user experiences and seamless connectivity with the world of Windows, and TI's BSPs will further help developers improve efficiency while differentiating their devices."
Pricing and availability
Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices are available for free download at www.ti.com/wincebsp-prtf.
About Texas Instruments
Texas Instruments (NYSE:TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.
Source: Texas Instruments Incorporated
CONTACT:
Tara Stratton of GolinHarris,
+1-972-341-2562,
tstratton@golinharris.com, for Texas Instruments;
or
Lori Scott of Texas Instruments,
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ljscott@ti.com,
Web Site: www.ti.com/
