Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech
ATLANTA, GAÂ - Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.
Company representatives will discuss Akrometric's TherMoire' AXP modular metrology platform that provides shadow moire', digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoire systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, as well as graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.
For more information about Akrometrix, visit www.akrometrix.com.
About Akrometrix LLC
Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at Sales@Akrometrix.com or visit www.Akrometrix.com.
Contact:
Akrometrix
Eric J. Moen, Vice President of Sales Marketing
404-486-0880 x21
E-mail: EMoen@akrometrix.com
