The Best Solution for Depaneling


Several technologies are available for "depaneling" circuit boards, the difficulty is determining the best method of separating the highly valuable boards without damaging them. Depaneling methods can be manual, semiautomatic or fully automatic. They separate boards, by bending, pinching, punching, routing, sawing or shearing. Which technology to use depends on the design of the board, on production volume, and on how the boards are connected. The key is to pick the method that puts the least amount of stress on that particular panel.

Pinching is a two-blade method for separating scored boards. A circular blade is paired with a second circular blade or a linear blade. To separate the boards, the panel is passed between the blades along the score line, this does not cut the board as much as it pushes them apart putting very little stress on the board.

Depanelizing up to 24 inch scored printed circuit boards is made easy and convenient with the FKN Systek K3000 Linear blade depanelizer. The gap between the blades is adjustable to the thickness of the board. The larger the clearance between the blades, the lower the stress exerted on the boards during separation. Simply place the bottom score line of the board onto the linear blade and pull the circular blade across the top score line to cleanly separate the panels. An adjustable front and back table can be tilted so that separated panels can slide onto a conveyor belt. Adjustable blade guards on each side of the circular blade provide operator protection from the working area. Blades are made of long lasting tool steel.

FKN Systek offers a full line of Depanelizers, also available is a motorized linear blade depanelizer, which separates panels when the operator steps on a foot switch.
For more Information: www.fknsystek.com

FKN Systek
86 Kendall Avenue
Framingham MA 01702
Tel: 508 935 2282 Fax: 508 935 2286
E Mail: fkn@fknsystek.com
www.fknsystek.com

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