Association News

SMD Quality, Reliability Standard focuses on non-IC components.

Press Release Summary:

February 8, 2012 - C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitive Components specifically covers non-IC electronic components classified per EIA/IPC/JEDEC J-STD-075. SMD manufacturers and users gain standardized methods thta help prevent damage from moisture absorption and exposure to solder reflow temperatures. Also, revision contains correction made to desiccant calculation and allowance for less use of desiccant for MSL2 parts.

IPC-Association Connecting Electronics Industries - Bannockburn, IL

Original Press Release

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Press release date: February 6, 2012

BANNOCKBURN, Ill., and ARLINGTON, Va., USA - IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes. J-STD-033C effectively provides guidance for this category of electronic components that has not been covered by any standard in the past. IPC/JEDEC J-STD-033C provides surface mount device (SMD) manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Use of the standard helps achieve safe and damage-free reflow with the dry-packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags. In addition to its expanded scope, the C revision contains a correction made to the desiccant calculation and an allowance for less use of desiccant for MSL2 parts, if desired. To help users understand the importance of moisture-barrier bags (MBBs) for maintaining the shelf life of packaged ICs and non-ICs, J-STD-033C includes diagrams of recommended, not recommended and acceptable MBB air evacuation. The latest version of J-STD-033C is available through JEDEC at or IPC at About IPC IPC ( is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China. About JEDEC JEDEC is the leading developer of standards for the microelectronics industry. Over 4,000 participants, appointed by nearly 300 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit


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