Seven IPC APEX EXPO Technical Conference Sessions go global.
Press Release Summary:
January 25, 2011 - On April 12-14, 2011, IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of 7 of show's 35 technical conference sessions, enabling individuals who cannot travel to show to experience a portion of the technical conference from their offices, homes, or even on the road. Seven sessions will include Encapsulation, Soldering Processes II, Lead Free: Surface Effects, PCB Reliability Test Methods, Cleaning, Thermal Cycling Lead-Free Reliability, and Embedded.
Original Press Release
Seven IPC Apex Expo Technical Conference Sessions Go Global - Live from Las Vegas
Press release date: January 19, 2011
Laser Based Technology for Solder Ball: Repair, Rework, and Reballing, Andrew Strandjord, Ph.D., Pac Tech USA Packaging Technologies Inc.
A Cost Effective and User Friendly N2 Inerting Technology for Lead-Free Wave Soldering, Chun Christine Dong, Ph.D., Air Products & Chemicals
Case Study Comparing the Solderability of a Specific Pb-Free, No-Clean Paste in Vapor Phase and Convection Reflow, Theron Lewis, IBM Corporation S13: Lead Free: Surface Effects - Wednesday, April 13, 2011 9:00 am-10:00 am PT
Effects of Tin Whisker Formation on Nanocrystalline Copper, David Lee, Ph.D., Johns Hopkins University
Effect of Gold Content on the Reliability of SnAgCu Solder Joints, Jianbiao Pan, Cal Poly State University S16: PCB Reliability Test Methods - Wednesday, April 13, 2011 10:15 am-11:45 am PT
A New Approach for Early Detection of PCB Pad Cratering Failures, Anurag Bansal, Cisco Systems Inc.
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy, Xiaofei He, University of Maryland
The Effects of Reflow on Conductive Anodic Filament (CAF) Performance of Materials, Kim Morton, Viasystems Technology Corp. LLC S24: Cleaning - Wednesday, April 13, 2011 1:30 pm-3:30 pm PT
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues, Mike Bixenman, DBA, Kyzen Corporation
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights, Michael Savidakis, Petroferm
Comparative Cleaning Study to Showcase the Effective Removal of OA Flux Residues, Umut Tosun, ZESTRON America
Defluxing for New Assembly Requirements, Barbara Kanegsberg, BFK Solutions S28: Thermal Cycling Lead-Free Reliability - Thursday, April 14, 2011 9:00 am-10:00 am PT
Pb-Free Solder Joint Reliability in a Mildly Accelerated Test Condition, Richard Coyle, Alcatel-Lucent
The Effects of Non-Filled Microvia in Pad on Pb-Free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling, Joseph Smetana, Alcatel-Lucent S33: Embedded - Thursday, April 14, 2011 10:15 am-11:45 am PT
Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology, Arnaud Grivon, Thales Services EPM
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing, Mohammed Alam, University of Maryland
Components: A Comparative Analysis of Reliability, Christopher Ryder, AT&S Austria Technologie & Systemtechnik AG Registrants of the cyber conference as well as registrants of the full IPC APEX EXPO technical conference will have free access to archives of the seven sessions until August 31. In addition, they will each receive the full technical conference proceedings. For more information and to register for the IPC APEX EXPO Cyber Conference, visit IPCAPEXEXPO.org/Cyber-Conference. About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.