Original Press Release
Industry Challenges Get Priority Attention from IPC APEX EXPO Professional Development Course Instructors
Press release date: November 28, 2011
IPC Social Media Platforms Help Start the Dialogue
BANNOCKBURN, Ill., USA - Genuine electronics manufacturing industry concerns, challenges and problems will be addressed in 50 IPC APEX EXPO professional development courses, February 26-27 and March 1, 2012, at the San Diego Convention Center.
Covering critical issues in design, manufacturing, assembly and test, the courses go beyond theory to provide practical solutions to industry challenges. This year, with a little help from social media outlets, instructors are gathering input on actual challenges that industry engineers, PCB designers and manufacturing technicians face. Conversations on IPC social media outlets, including LinkedIn, Facebook and IPC Technet, will ensure that courses provide, as Susan Filz, IPC director of industry programs, puts it, "not only the premier standard of education, but also practical and direct solutions to real challenges."
"The value gained by participants is ten-fold when instructors can directly address individual needs or concerns," says Filz. She adds that instructors like Dr. Bhanu Sood, University of Maryland, and Bob Willis, of ASKbobwillis.com are already engaging in dialogue with industry and others are expected to join in conversations online soon.
IPC APEX EXPO faculty members are top experts in the industry, including: Daniel DiTuro, Honeywell International; Dale Lee, Plexus Corp.; Dr. Rita Mohanty, Speedline Technologies; Dr. Michael Osterman, CALCE; Douglas Pauls, Rockwell Collins; David Pinsky, Raytheon Corp.; Christopher Ryder of AT&S Austria Technologie & Systemtechnik AG; Cheryl Tulkoff, CRE, DfR Solutions; Phil Zarrow, ITM Consulting; as well as other distinguished technologists.
The professional development curriculum includes:
Counterfeit Components - Causes, Cures and Solutions (PD09)
Design and Packaging for Space Hardware and Other High-Reliability Applications (PD12)
Best Practices in Electronics Assembly Processes - Parts I and II (PD-13 and PD-17)
Preventing Production Defects and Failures (PD-15)
Controlling Moisture Content in Boards: Best Practices (PD19)
Failure Analysis: Lessons Learned (PD23)
PoP and BTC Assembly - Material, Process and Reliability (PD-26)
HDI: Introduction to Processes and Products (PD34)
Lead-Free Assembly for High Yields and Reliability (PD37)
Design and Assembly Challenges of BGAs and BTCs (PD39)
Tin Whiskers: Origin, Propensity, Mitigation (PD42)
Practical Tips for Rework of Advanced Packages (PD-51)
The complete list of professional development courses along with descriptions and instructor biographies is available at www.ipcapexexpo.org/courses. Each course consists of three hours of classroom instruction and includes a handbook for every attendee.
Early-bird registration discounts for the professional development courses and other IPC APEX EXPO programs are available through January 28, 2012. To view all registration options or to register, visit www.IPCAPEXEXPO.org/register.
To join in on the discussions, visit www.ipc.org/Technet, www.ipc.org/LinkedIn, www.ipc.org/Facebook, and www.ipc.org/twitter. For information on all the activities at IPC APEX EXPO, including the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test, visit www.IPCAPEXEXPO.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.