Original Press Release
Papers are Invited for ASTM International Symposium on Creep-Fatigue Interactions
Press release date: December 10, 2009
W. CONSHOHOCKEN, Pa. - Papers are invited for the International Symposium on Creep-Fatigue Interactions: Test Methods and Models, to be held Nov. 17-19, 2010, at the Grand Hyatt San Antonio in San Antonio, Texas. Sponsored by ASTM International Committee E08 on Fatigue and Fracture, Electric Power Research Institute (EPRI) and the International Congress on Fracture (ICF) - Inter-quadrennial Conference, the symposium will be held in conjunction with the Nov. 15-18 standards development meetings of Committee E08.
This two and one-half day symposium will address the latest research in the area of creep-fatigue crack formation and crack growth in high temperature materials and structures. Presentations on all aspects of research in the area of creep-fatigue interactions are sought to enable exchange of information and ideas on the topics below.
Papers on recent developments in test equipment, experimental techniques, models for representing the data and applications of the data are being sought. Topics of interest include: crack formation and crack growth under creep-fatigue; early/short crack growth under creep-fatigue; creep-fatigue behavior of welds; effect of creep on subsequent fatigue strength; effect of fatigue on subsequent creep behavior; constitutive models for creep-fatigue deformation, application of creep-fatigue models to structures; test methods; high resolution displacement measurements at elevated temperatures; crack length monitoring; data acquisition; treatment of scatter in data; correlating parameters and their validity; models for representing data and applications of data; precision and bias in creep-fatigue testing; and uncertainty analysis and propagation of errors.
Interested presenters must submit a 300-500 word abstract online at www.astm.org/E08symp1110.htm by April 15, 2010. Symposium co-chairs Ashok Saxena and Bilal Dogan will notify you via postal mail by June 15, 2010, of your paper's acceptability for presentation. Symposium presenters are required to submit their papers to the Journal of ASTM International (JAI). JAI is an online, peer-reviewed journal for the international scientific and engineering community (www.astm.org/JAI).
For additional information, visit the symposium home page on the ASTM Web site (www.astm.org/E08symp1110.htm).
For additional technical information, contact symposium co-chairs Ashok Saxena, Ph.D., University of Arkansas, Fayetteville, Ark. (phone: 479-575-3054; firstname.lastname@example.org); or Bilal Dogan, Ph.D., EPRI, Charlotte, N.C. (phone: 704-595-2650; email@example.com).
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