OEMs to outline expectations, challenges for supply chain.
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Press Release Summary:
Scheduled for April 2, 2009, IPC APEX EXPO(TM) OEM Summit will include speakers from IBM and Hewlett-Packard Company. Martin Rausch of Intel Corp. will discuss challenges of making transition to halogen-free materials, while Michael Roesch of Hewlett-Packard will address challenges for large OEMs managing materials changes and reliability impact on electronic assemblies in complex supply chain. Dr. Kitty Pearsall of IBM will present IBM End to End Supplier Quality Management System.
Original Press Release:
Major OEMS To Outline Expectations, Challenges For Supply Chain At IPC Apex Expo Free Session
BANNOCKBURN, Ill., USA, March 2, 2009 - Intel Corp., IBM and Hewlett-Packard Company will take the stage at the IPC APEX EXPO(TM) OEM Summit to define key issues they are facing in halogen-free materials, materials reliability and supplier quality. The OEM Summit will take place Thursday, April 2, 8:00 am-10:00 am, at the Mandalay Bay Resort & Convention Center, Las Vegas.
Martin Rausch, general manager of System Manufacturing TD for Intel Corp., will discuss the challenges involved in making the transition to halogen-free materials - issues that he does not believe are widely understood within the supply chain. "There are a lot of challenges that people may not even realize yet," says Rausch. "I see three major areas: a) electrical sensitivities such as changes in the dielectric constant, b) mechanical issues such as problems with shock and vibration from the more rigid materials associated with halogen-free and c) serious design challenges to avoid."
When asked about the controversy around halogen-free materials in the industry, Rausch responded, "I'm just a technical guy in the lab. OEMs have all sorts of pressures from customers and non-governmental organizations in the communities we serve. My hope is to alert the supply chain to understand the changes, and to have a holistic view of how to resolve them. Individual companies either need to prepare for a future transition or risk being left behind as the industry moves ahead."
Michael Roesch, manager, Reliability and Test Engineering, Global Engineering Services (GES) for Hewlett-Packard Company, will address the challenges for a large OEM managing materials changes and their reliability impact on electronic assemblies in an increasingly complex supply chain. "Materials changes can be driven by performance, cost or manufacturing reasons or they may be mandated by new legislation. The balance we try to strike is to determine how to best evaluate the impact of these changes by testing the materials ourselves, asking our manufacturing partners to test or working through industry standards committees or consortia to assess materials choices. What we want to avoid is an impact on manufacturability and reliability while at the same time not stifling innovation and approving the use of 'better materials," comments Roesch. He will share examples by discussing management of alternative lead-free solder alloys, new laminates and solder pastes and fluxes.
Dr. Kitty Pearsall, DE, ISC Procurement Engineering, IBM, routinely leads strategic procurement initiatives focusing on high quality and solid reliability of the final end product. Kitty will present the IBM End to End (E2E) Supplier Quality Management System that includes the traditional elements of supplier selection, qualification and monitoring. She will break down these elements into supplier selection and controls, supplier process assurance and incoming quality and supplier monitoring and monitoring of the supplier's suppliers. At each phase, key metrics will be shared that include IBM's supplier/EMS requirements: environmental and antismoke, target setting objectives, data that demonstrates requirements are being met, problem management, corrective action, executive technical reviews, and supplier scorecards.
For more information on the OEM Summit, visit IPCAPEXEXPO.org/oem-summit. All pre-registered attendees will receive entrance to this session at no charge, along with admission to the exhibit hall and other free events. To learn more about the show, visit www.IPCAPEXEXPO.org.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai and Shenzhen, China.
