Material Highlight: 3M Thermally Conductive Interface Pads


3M Thermally Conductive Acrylic Interface Pads are used to transfer heat from a hot surface or device to a cooler surface region of the assembled design.  The 3M Thermally Conductive Pads are available in acrylic, where a non-silicone base material is desired. The pads are designed in a variety of thermal conductivities and softness grades to provide excellent gap filling, low assembled stress and a high degree of wet-out for a more efficient heat transfer. This article is going to focus specifically on the 3M 5571 and 5590H Acrylic Interface Pads.



3M™ Thermally Conductive Acrylic Interface Pad 5571



5571 is designated to provide a preferential heat transfer path between heat generating components like Integrated Circuit Chips and heat spreaders as aluminum heat sink.



3M™ Thermally Conductive Acrylic Interface Pad 5571 consists of a highly conformable slightly tacky acrylic elastomeric sheet filled with conductive ceramic particles which provides special features including:



• High thermal conductivity.

• Good softness and conformability

• Excellent flame retardant, UL94 V-0 equivalent material.

• No gas/oil bleeding, which often causes electric connection failure.

• High pressure relaxation reduces pressure to electric components.

• Good electrical insulation properties.

• Slight tack allows easy pre-assembly.

• Good wetting performance for better thermal conductivity.



3M™ Thermally Conductive Acrylic Interface Pad 5590H



5590H is a soft acrylic based pad is also designed to provide a preferential heat transfer path away from heat generating components. Because of its softness, 3M Interface Pad 5590H can decrease the load to integrated circuit chips during compression, and provides good tack to many surfaces. These properties lead to a high performance non-silicone based thermal pad.



3M Interface Pad 5590H is a higher thermal conductivity and somewhat firmer acrylic thermal pad, versus 3M Interface Pad 5589H. Special features include:



• Good softness and conformability to non-flat surfaces.

• Excellent compressive stress relaxation.

• High thermal conductivity.

• UL94 V-O certified

• Good surface tack leads to low thermal resistance at surface.

• Non-silicone acrylic elastomer.

• Good dielectric performance.

• Excellent durability for long term thermal conductivity and electric insulation stability.



Common Applications for 3M 5571 + 5590H:



• Integrated Circuit Packaging Heat Conduction

• Heat Sink Bonding

• COF Chip Heat Conduction

• LED Board TIM

• HD TV Address IC Chip and Scan Module Board

• General Gap Filling in Electronic Device



Next week we will conclude Thermal Month with 3M with an overview of what SRP can provide to various companies and industries looking to solve Thermal Management application problems.




Contact This Company

All Topics