Jasbir Bath Joins IPC as assembly technology principal engineer.
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Press Release Summary:
Jasbir Bath, of Bath and Associates Consultancy LLC, joined IPC staff on project basis as principal engineer within IPC's assembly technology area. He will be responsible for providing input and support for various IPC assembly technology standards as well as IPC's International Technology Roadmap. IPC VP of standards and technology Dave Torp favorably cited Jasbir's near 20 years of experience and knowledge of lead-free and tin-lead soldering technologies.
Original Press Release:
Jasbir Bath Joins IPC as Principal Engineer
BANNOCKBURN, Ill., USA, IPC – Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.
As principal engineer, Bath will have responsibility for providing input and support for various IPC assembly technology standards as well as IPC’s International Technology Roadmap.
“Jasbir has nearly 20 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. His experience, combined with his extensive knowledge of lead-free and tin-lead soldering technologies, makes Jasbir a welcome addition to our expert technical staff,” said Dave Torp, IPC vice president of standards and technology.
Bath began his engineering career as a technical officer at ITRI (formerly the International Tin Research Institute) in the United Kingdom. In 1998, he joined Flextronics International/Solectron Corporation as a lead engineer specializing in tin-lead and lead-free soldering materials, processes and components. In 2008, Bath formed his own consultancy firm, Bath and Associates Consultancy LLC, which provides process consulting and training services for the electronics manufacturing industry.
A contributor to four books on lead-free manufacturing, Bath has worked closely with IPC’s Solder Products Value Council (SPVC) to develop process and reliability data for Sn3Ag0.5Cu solder and served on an IPC Blue Ribbon Committee to develop the IPC Lead-free Process Certification Site Audit program. He holds B.S. and M.S. degrees in materials science from the University of Manchester/UMIST in England.
Regarding IPC-related activities, Bath can be reached at JasbirBath@ipc.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
