Association News

IPC to hold conference on HDI technology.

Press Release Summary:

August 12, 2008 - IPC - Association Connecting Electronics IndustriesĀ® will offer a 3-day HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008 in Dallas. The conference will lay the groundwork for competing in the growing HDI market, addressing HDI technology as it relates to all aspects of the supply chain. Keynote addresses will be given by Matt Holzmann and Roberto Tulman and the 2Ā½-day conference will be divided into 4 phases following the implementation program.

IPC-Association Connecting Electronics Industries - Bannockburn, IL

Original Press Release

Growing HDI Market - IPC Conference to Help North American PCB Companies Raise Competitive Advantage

Press release date: August 8, 2008

BANNOCKBURN, Ill., USA, August 8, 2008 - HDI (high density interconnect) technology represents the fastest growing segment of the global PCB market; yet the use of high density interconnects in North America has lagged behind the rest of the world. To help North American PCB companies increase their competitive advantage, IPC - Association Connecting Electronics IndustriesĀ® will offer a three-day HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008 in Dallas. Led by a team of industry experts, the conference will lay the groundwork for competing in the growing HDI market, addressing HDI technology as it relates to all aspects of the supply chain - from design through assembly - with an emphasis on reliability and endurance. On October 6, instructors will dedicate a full day to cover key areas for those interested in the technology. Key design recommendations will be shared with engineers who want to know what HDI can do for their next printed circuit board. Engineers will gain insight into how HDI board designers select stackups, design rules and features and they will learn about issues that arise when fabricating an HDI-microvia board. Highlights of the October 7 technical conference agenda include two special keynote addresses. Matt Holzmann, president of Christopher Associates, a pioneering supplier to the electronics industry, will open the conference with "Demand for HDI." The afternoon keynote, "High-end Rigid and Flex-Rigid Boards: Case Studies and Reliability," will be presented by Roberto Tulman, vice president of technologies for Eltek, a leading HDI manufacturer in both the military and medical arenas. The event will wrap up with two half-day advanced HDI workshops on October 8, targeted to both PCB designers and fabricators. The morning workshop will explore existing and future materials suitable for use in HDI products, in addition to materials for embedded passives and high-frequency operation. In the afternoon workshop, participants will walk through a successful program used by a number of large aero/military and telecom OEMs to successfully implement HDI technologies in their PCB programs. The session is divided into four phases that follow the implementation program: 1) education, planning and vendor audits; 2) test-vehicle creation and testing; 3) redesigning a current board to HDI; and 4) putting it all together. For additional information on the conference, including the complete agenda and registration form, visit ipc.org/HDIConference or contact Michelle Michelotti, IPC Professional Development coordinator at +1 847-597-2822 or michmi@ipc.org. About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

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