IPC Seeks Technical Conference Abstracts for IPC APEX EXPO 2016.
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Press Release Summary:
IPC invites researchers, academics, technical experts, and industry leaders to submit 300-word technical conference abstracts for IPC APEX EXPO 2016, which will take place March 15–17 in Las Vegas, NV. Papers and presentations are being sought on design, materials, assembly, processes, and equipment, and awards will be presented for "Best Paper" to recognize exceptional achievement. Deadline for technical conference paper abstracts is September 14, 2015.
Original Press Release:
IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016
Deadline for technical conference paper abstracts extended to: September 14, 2015
BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.
The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Expert papers and presentations are being sought on design, materials, assembly, processes and equipment in the following areas:
• Automation in Electronics Manufacturing
• Adhesives
• Advanced Technology
• Area Array/Flip Chip/0201 Metric
• Assembly and Rework Processes
• BGA/CSP Packaging
• Black Pad and Other Board Related Defect Issues
• BTC/QFN/LGA Components
• Business & Supply Chain Issues
• Cleaning
• Conformal Coatings
• Corrosion
• Counterfeit Electronics
• Design
• Electromigration
• Embedded Passive & Active Devices
• Environmental Compliance
• Lean Six Sigma
• LED Manufacturing
• Failure Analysis
• Flexible Circuitry
• HDI Technologies
• Electronics Manufacturing Services
• Head-on-Pillow
• Board and Component Warpage
• High Speed, High Frequency & Signal Integrity
• Lead-Free Fabrication, Assembly & Reliability
• Miniaturization Nanotechnology Optoelectronics
• Packaging & Components
• PCB and Component Storage & Handling Performance
• Quality & Reliability
• Photovoltaics
• PoP (Package-on-Package)
• Printed Electronics
• PCB Fabrication
• Reshoring
• RFID Circuitry
• Robotics
• Soldering
• Surface Finishes
• Test, Inspection & AOI
• Tin Whiskers
• 2.5-D/3-D Component Packaging
• Underfills
• Via Plugging & Other Protection
• Wearables
A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.
To submit an abstract for the technical conference, visit www.IPCAPEXEXPO.org/CFP.
For more information about conference papers and presentations, contact Jasbir Bath, IPC conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.
About IPC
IPCÂ (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
