Original Press Release
IPC Honors Volunteers for Their Contributions to IPC Standards and Program Development
Press release date: September 23, 2008
More than 70 Awards Presented at IPC Midwest
BANNOCKBURN, Ill., USA, September 23, 2008 - IPC - Association Connecting Electronics Industries® presented Distinguished Committee Leadership, Special Recognition and Distinguished Committee Service awards at IPC Midwest Conference & Exhibition, held September 21-25, at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, Ill.
The awards were presented to individuals, teams and organizations that made significant contributions to IPC and the industry by lending their expertise and time to standards and program development.
Special Recognition Award recipients were:
o Japan Electronics Packaging and Circuits Association (JPCA), for significant support to industry efforts on standardization of flex circuits including IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.
o Joel Peiffer, 3M Company, for leadership and contributions to revision A of IPC-TM-650, Method 184.108.40.206, Dielectric Withstanding Voltage (Hi-Pot Method) - Thin Dielectric Layers for Printed Boards.
o Nancy Chism, Flextronics; Barry Morris, Advanced Rework Technology; Norma Moss, L-3 Communications; Zenaida Valianu, Celestica International Inc.; and Debbie Wade, Advanced Rework Technology, for their contributions to the 7-34T subcommittee that helped develop the IPC-7711/7721B Training and Certification Program.
Distinguished Committee Leadership Awards were presented to:
o Daniel Foster, STI Electronics; and Teresa Rowe, AAI Corporation, for leadership of the 7-34T subcommittee in the development of IPC-7711/7721B Training and Certification Program.
o Michael Green, Lockheed Martin Space Systems Company; and Vicka White, Honeywell Inc. Air Transport Systems, for their leadership of the 2-30 Committee that developed revision H of IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
o Dr. Scott Strand, IBM Corporation; and Neil Witkowski, Alcatel-Lucent, for leadership of the 9-82 Power Devices Standard Subcommittee that developed IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications.
o David McGregor, E.I. du Pont de Nemours and Co.; Mahendra Gandhi, Northrop Grumman Space Technology; and Rocky Hillburn, CAC, for leadership of the D-52 Embedded Component Materials Subcommittee that helped develop IPC-4811, Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards.
o Dr. Arvind Partha, Somers Thin Strip; and Rolland Savage, High Performance Copper Foil Inc., for leadership of the 3-12a Metallic Foil Task Group that developed IPC-4562A, Metal Foil for Printed Board Applications.
o Mark Finstad, Minco Products Inc.; and William Ortloff, Raytheon Company, for leading the D-11 subcommittee that helped develop revision B to IPC-2223, Sectional Design Standard for Flexible Printed Boards.
o Mahendra Gandhi, Northrop Grumman Space Technology; and Nick Koop, Minco Products Inc., for leadership of the D-12 subcommittee that developed revision B of IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.
o Ray Prasad, BeamWorks Inc., for leading the 5-21g task group that developed revision B of IPC-7095, Design and Assembly Process Implementation for BGAs.
Distinguished Committee Service Awards were bestowed upon:
o Terry Clitheroe, Solder Technologies; Stephen Fribbins, Fribbins Training Services; James Moffitt, Moffitt Consulting Services; Blen Talbott, L-3 Communications; Sharon Ventress, U.S. Army Redstone Arsenal; Jennifer Day, Sanmina-SCI; and Peggi Blakley, NSWC Crane, for their efforts in the development of the IPC-7711/7721 Training and Certification Program.
o Alan Exley, Raytheon Company; Mahendra Gandhi, Northrop Grumman Space Technology; Dr. J. Lee Parker, JLP; Gordon Sullivan, Huntsman Advanced Materials; and Dewey Whittaker, Honeywell Inc. Air Transport Systems, for their contributions to the development of revision H of IPC-T-50, Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
o Gary Gong, Cisco Systems Inc.; T. Paul Parker, Lineage Power; Rudolf Wegener, Hewlett-Packard Company; Robert V. White, Consultant; Donald Gerstle, Murata Power Solutions; Tom Glowinke, Alcatel-Lucent; Michael Model, Lineage Power; Anders Petersson, Ericsson Power Module AB; Anne Ryan, Alcatel-Lucent; Lynn Simmons, Dell Inc.; Jerry Strunk, Lineage Power; and Eric Swenson, IBM Corporation, for their contributions to the development of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications.
o John Andresakis, Oak-Mitsui, Inc.; John Bauer, Rockwell Collins; Daniel Brandler, Ohmega Technologies Inc.; Dr. G. Sidney Cox, E.I. du Pont de Nemours and Co.; Jason Ferguson, NSWC Crane; Dennis Fritz, MacDermid, Inc.; Dr. Jan Obrzut, NIST; Joel Peiffer, 3M Company; and Dr. Akikazu Shibata, JPCA, for contributions to IPC-4811, Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards.
o Tracy Cai, Guangdong Shengyi Sci. Tech Co. Ltd.; William Hall, Oak-Mitsui; John Jephson, Circuit Foil Trading, Inc.; Duane Mahnke, Rogers Corporation; and Edward Sandor, Taconic Advanced Dielectric Division, for contributions to the development of IPC-4562A, Metal Foil for Printed Board Applications.
o Michael Green, Lockheed Martin Space Systems Company; and Michael Luke, Raytheon Company, for contributions to IPC-2223B, Sectional Design Standard for Flexible Printed Boards.
o Takahisa Akatsuka, Nippon Mektron Ltd.; C. Don Dupriest, Lockheed Martin Missiles and Fire Control; Alan Exley, Raytheon Company; Thomas Gardeski, E.I. du Pont de Nemours and Co.; and Toru Koizumi, JPCA, for contributions to IPC-6013, Qualification and Performance Specification for Flexible Printed Boards.
o Dudi Amir, Intel Corporation; Dr. Raiyomand Aspandiar, Intel Corporation; Werner Engelmaier, Engelmaier Associates, L.C.; Michael Green, Lockheed Martin Space Systems Company; Karen McConnell, Lockheed Martin EPI Center; George Oxx, Flextronics International USA; Robert Rowland, RadiSys Corporation; Vern Solberg, Solberg Technical Consulting; Kristen Troxel, Hewlett-Packard Company; and Bob Willis, The SMART Group, for their contributions to IPC-7095B, Design and Assembly Process Implementation for BGAs.
For more information on the awards or award recipients, contact Anna Garrido, IPC director of marketing and communications at +1 847-597-2804 or AnnaGarrido@ipc.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.