Original Press Release
IPC Offers Technical Seminars at National Electronics Week
Press release date: May 2, 2008
BANNOCKBURN, Ill, USA, May 2, 2008 - IPC - Association Connecting Electronics Industries® is pleased to announce a series of in-depth technical seminars to be held in conjunction with National Electronics Week (NEW). Focusing on next generation technologies in design, fabrication and assembly, the IPC technical seminars will take place June 17-19, 2008 at Earls Court, London.
IPC presents an international team of instructors to lead 15 full- and half-day courses designed to offer attendees insight on board and assembly production at lowest cost, innovations in advanced packaging, and the latest developments in lead-free reliability, process troubleshooting and more. Sessions include:
Achieving High Reliability for Lead-Free Solder Joints - Material Considerations Ning-Cheng Lee, Ph.D., Indium Corporation of America Designing PCBs for Lowest Cost - Reducing Layers and Other DfM Principles Happy Holden, Mentor Graphics Surface Mount Technology: Principles & Practice in a Lead-Free World Ray Prasad, Ray Prasad Consultancy Group Updating Rework and Repair for Lead-Free Barry Morris, ART- Advanced Rework Technology Lead-Free Reliability for Harsh Environment Electronics Jennie Hwang, Ph.D., H-Technologies Group Design for Reliability, Reliability Testing & Data Analysis, and Failure Analysis of Lead-Free Solder Joints John Lau, Ph.D., Institute of Microelectronics What is HDI? Do you Need HDI? How to Get Started Happy Holden, Mentor Graphics Lead-Free BGA Reliability in Packaging and Assembling Jennie Hwang, Ph.D., H-Technologies Group Ball Grid Array: Principles and Practice Ray Prasad, Ray Prasad Consultancy Group Stencil Printing Process for Solder Paste Application: An In-Depth Look S. Manian Ramkumar, Ph.D., Rochester Institute of Technology Reliability Issues with Lead-Free Soldering Processes Werner Engelmaier, Engelmaier Associates L.C. True Design for Reliability: Understanding What Is and What Is Not DfR Craig Hillman, Ph.D., DfR Solutions Advanced Component Packages - An Introduction Including Lead-Free Implementation S. Manian Rumkumar, Ph.D., Rochester Institute of Technology Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (PTHs/PTVs), Including Lead-Free Soldering Impact Werner Engelmaier, Engelmaier Associates L.C. Understanding Failure and Root-Cause Analysis in Lead-Free Electronics Craig Hillman, Ph.D., DfR Solutions
Speaking on IPC's commitment to deploy and transfer technology on a global basis, IPC President Denny McGuirk said, "We are thrilled to bring technical expertise and experience closer to our 330 European corporate members - and the entire electronics community. IPC is poised to lead the electronics industry into next generation technologies and we believe NEW is an excellent platform to keep the industry informed of the latest trends."
Full IPC seminar descriptions are available at ipc.org/IPC-UK. For more information, contact Anne Marie Mulvihill, IPC program manager for professional development, at AnneMarieMulvihill@ipc.org or call +1 847-597-2827.To register, visit ipc.org/NewReg08.
For complete event information, go to www.nationalelectronicsweek.co.uk or send an e-mail to email@example.com.
About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.