Association News

IPC issues call for papers for 2009 IPC APEX Expo.

Press Release Summary:

June 5, 2008 - Researchers, academics, technical experts, and industry leaders are invited to submit abstracts for 2009 IPC APEX EXPO scheduled for March 29 to April 2. Presentations are being sought on all relevant electronics' design, PCB fabrication, and manufacturing topics. Submissions in areas of new materials and environmental concerns are especially encouraged. Due July 18, 300-word abstract should summarize original and previously unpublished work covering case histories, research, and discoveries.

IPC-Association Connecting Electronics Industries - Bannockburn, IL

Original Press Release

IPC Issues Call For Papers For 2009 IPC APEX Expo

Press release date: June 2, 2008

BANNOCKBURN, Ill., USA, June 2, 2008 - IPC - Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2009 IPC APEX EXPO held at Mandalay Bay Resort and Convention Center, Las Vegas, March 29-April 2, 2009. IPC APEX EXPO is the world's premier conference and exhibition for the electronic interconnect industry - developed and presented by the industry for the industry - and provides a significant opportunity to build visibility for presenters and their companies. Expert presentations are being sought on all relevant electronics' design, PCB fabrication and manufacturing topics. Submissions in the areas of new materials and environmental concerns are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by July 18, 2008. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of the technical and/or appropriate test results in the final paper. Proposals are also solicited for full-day and half-day professional development courses on design, printed circuit board and electronic manufacturing processes and materials. All abstracts and proposals are due July 18, 2008. To submit an abstract or proposal, visit www.GoIPCShows.org/CFP. For more information about conference participation, contact Greg Munie, conference director, at GregMunie@ipc.org or Michelle Michelotti, professional development coordinator, at MichelleMichelotti@ipc.org or +1 847-597-2822. About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

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