Original Press Release
IPC International Conference Offers Answers to Challenges of Flexible Circuits
Press release date: March 26, 2010
BANNOCKBURN, Ill, USA - One of the fastest growing segments of the PCB market worldwide, flexible circuits provide new opportunities in the areas of creative design, miniaturization, circuit density and interconnection reliability to help boost a company's bottom line. In fact, many of today's advanced applications can only take place using flexible circuitry, so learning how to utilize special materials and fabrication processes is key. To provide timely information on the application of sound scientific and engineering practice of flexible circuits, the IPC International Conference on Flexible Circuits will be held June 15-16, 2010, in Irvine, Calif., with half-day workshops on June 15 and a full-day of technical conference sessions on June 16.
On the morning of Tuesday, June 15, Michael Carano, vice president, OMG Electrical Chemicals, will deliver a workshop focusing on critical process parameters required for the proper desmear, metallization and electrodeposition of flexible and rigid-flexible substrates. The afternoon workshop led by Brent Sweitzer, senior R &D engineer, Multek Flexible Circuits, Inc., will address the factors inherent in the determination of appropriate materials and test strategy.
The technical conference on June 16 will kick off as Al Wasserzug, director of business development, Vulcan Flex Circuit Corporation, and Jay Desai, director of marketing for MFlex, reveal the growing business opportunities that exist for flex manufacturers. Robert Burns, national sales and marketing director, Printed Circuits, Inc., will discuss the current use of embedded passives in flex circuits. Happy Holden, chief technical officer, Foxconn, and Robert Sheldon, applications engineering manager, Pioneer Circuits, Inc. will lead a panel discussion and debate on impedance in a flex application.
The afternoon sessions' topics include packaging, reliability requirements, new applications for liquid crystal polymer and solving the challenges of materials performance. Speakers include Zach Gaubert, mechanical engineer, Raytheon; John Bauer, senior material and process engineer, Rockwell Collins; Mark Verbrugge, flex circuit applications engineer, Minco Products; and Sidney Cox, research associate, DuPont.
To register for the IPC International Conference on Flexible Circuits or for more information on the conference or tabletop and sponsorship opportunities, visit www.ipc.org/flex-conference or contact Anne Marie Mulvihill, IPC professional development manager, at AnneMarieMulvihill@ipc.org.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.