IPC Handbook addresses potting and encapsulating PCBs.
Press Release Summary:
August 13, 2012 - IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly covers broad range of protective materials for printed boards. Handbook includes information on choosing, mixing, applying, and dispensing for each material listed. In addition, it explains techniques that should be used when repairs are necessary. Book is 68 pages long with more than 50 illustrations.
Original Press Release
IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards
Press release date: August 9, 2012
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.