IPC ESTC offers opportunities for standards development.
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Press Release Summary:
During IPC Electronic System Technologies Conference, May 21-22, electronics professionals will have new venue for collaboration on IPC standards. IPC’s Requirements for Structural Enclosure Task Group will evaluate submissions for IPC-A-630, Acceptability Standard for the Design, Manufacture, Inspection and Testing of Electronic Enclosures. IPC’s Wire Harness Acceptability Task Group will work on an amendment to IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies.
Original Press Release:
IPC ESTC Offers New Opportunities for Standards Development
BANNOCKBURN, Ill., USA, — Electronics industry professionals have a new venue for collaboration on IPC standards, with opportunities to participate in standards development meetings during IPC Electronic System Technologies Conference (IPC ESTC) in Las Vegas May 21–22.
“IPC ESTC presents an opportunity to discuss key IPC standards in person, and welcome new colleagues to the conversation,” says Jack Crawford, IPC director of certification and staff liaison to the industry for several IPC standards. “While we can accomplish a lot through online collaboration and teleconferences, nothing compares to the energy and information exchange you get through face-to-face discourse.”
On Tuesday, May 21, IPC’s Requirements for Structural Enclosure Task Group, chaired by Eddie Hofer of Rockwell Collins and Richard Rumas, CIT, of Honeywell Canada, will evaluate submissions for a new standard, IPC-A-630, Acceptability Standard for the Design, Manufacture, Inspection and Testing of Electronic Enclosures.
On Wednesday, May 22, IPC’s Wire Harness Acceptability Task Group, led by chairs Theodore Laser, MIT, L-3 Communications and Brett Miller, USA Harness, Inc., will work on an amendment to the widely used joint standard, IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies.
In addition to the two standards meetings, a strategy meeting for a new organization, the Coalition for the Advancement of MicroElectronic Systems Technology (CAMEST), will take place at IPC ESTC on Tuesday, May 21. CAMEST is an independent organization dedicated to fostering collaboration among the global electronics industry, academia and government.
For more information on IPC ESTC and its standards development activities, or to register, visit www.ipc.org/estc. For more information on all IPC standards development activities, visit www.ipc.org/standards.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
