IPC APEX EXPO to address PCB cleaning process issues.
Press Release Summary:
December 6, 2012 - Featured at IPC APEX EXPO®, Printed Board Assembly Cleaning and Contamination Testing Center will provide practical guidance on implementing effective cleaning and contamination monitoring processes and help visitors overcome common reliability issues. Processes that will be demonstrated include: ionic testing, surface insulation resistance, solder paste flux cleaning, optical inspection, PCB and component compatibility testing, and ion chromatography with on-the-spot assessment.
Original Press Release
Practical Support on Cleaning and Contamination Monitoring Processes
Press release date: December 3, 2012
BANNOCKBURN, Ill., USA — Need to address cleaning process issues or process defect dilemmas? Help is just a show floor away as the Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.
Organized by IPC and National Physical Laboratory (NPL), the Center will provide practical guidance on implementing effective cleaning and contamination monitoring processes and help visitors overcome common reliability issues.
“We’re encouraging visitors to the Center to bring in board assemblies, components and failure analysis reports,” says Bob Willis, Center presenter and NPL Process Defect Database coordinator. “Right on the show floor, we’ll help to determine the true causes of failures and offer proven, viable solutions.”
Processes that will be demonstrated at the Center include: ionic testing, surface insulation resistance (SIR), solder paste flux cleaning systems, cleaning materials, optical inspection, PCB and component compatibility testing, ion chromatography with on-the-spot assessment, and more.
During the show, the Center will also feature 20-minute seminar presentations on topics such as cleaning equipment installation requirements, CAF failure and defect analysis and PCB assembly contamination measurement. In addition, the Center will offer live testing, prize drawings for cleaning standards, and a display of cleaning books and test boards available in the industry. There will also be an opportunity to meet some of the engineers who help develop the IPC industry standards on cleaning. Show participants can submit questions in advance by sending an e-mail to firstname.lastname@example.org.
Offering a sneak preview to the live clinic at IPC APEX EXPO, Willis and Dr. Chris Hunt, National Physical Laboratory, will present a free Printed Board Assembly Cleaning and Contamination Defect webinar on January 10, 2013, from 12:00 pm to 1:00 pm (Central time). The webinar will focus on the practical process issues related to cleaning printed board assemblies. Additional webinar topics include: component and PCB failures, lead-free cleaning issues, inspection criteria, cleanliness measurement and flux and cleaner compatibility.
For more information on the Center and other activities at IPC APEX EXPO, including the technical conference, standards development meetings and professional development courses, visit www.IPCAPEXEXPO.org. Access to the exhibit hall and Center is free to pre-registrants, a savings of $25 on-site. Individuals who register by January 25 for any of the event’s paid activities will save 20 percent off registration fees. Registration packages offering additional savings can be viewed at www.IPCAPEXEXPO.org/registration-options.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.