IPC and Northrop Grumman sponsor HDI conference.
Press Release Summary:
January 20, 2011 - Scheduled for March 1-2, 2011, IPC Conference on HDI: Strategies for the 21st Century will include technical workshops on March 1 and full-day technical conference on March 2, which will look at a High Performance Technology Roadmap presented by Northrop Grumman. Conference will also provide perspective from military and medical sectors, and cover assembly-related issues and HDI board reliability concerns, as well as considerations to make in design, materials, and processes.
Original Press Release
IPC and Northrop Grumman Sponsor HDI Conference
Press release date: January 18, 2011
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.