IPC and JEDEC announce international conference.
Press Release Summary:
October 21, 2008 - Scheduled for Dec 8-10, International Conference on Lead-Free Electronics will feature full-day technical conference covering topics such as RoHS challenges on electronic assembly and material, transitioning server motherboards to lead-free, and lead-free solder joint reliability. Half-day workshops will address topics such as lead-free solder process, data management for eco-compliance, lead-free compliance, and understanding failure and root-cause analysis in lead-free electronics.
Original Press Release
IPC and JEDEC Announce International Conference Offering Solutions to Challenges
Press release date: October 20, 2008
o RoHS Challenges on Electronic Assembly and Material
o Transitioning Server Motherboards to Lead-Free
o Characterization of the Thermal Stability of Electrical Laminates for Lead-Free Soldering
o XRF Verification of Component Terminations
o RoHS Compliant Components in a Non-RoHS Process
o Lead-Free Solder Joint Reliability
o PLM Solutions to Accelerate Lead-Free Electronics Designs
o A Component Supplier's Green Approach Those searching for information on reliability will find it covered from many angles in the half-day courses. Courses include:
o Lead-Free Solder Process - Survival, Quality, and Reliability: The Problems
o Lead-Free Solder Process - Survival, Quality, and Reliability: The Solutions
o Final Finishes and their Compatibility with Lead-Free Soldering
o Data Management for Eco-Compliance
o Lead-Free Reliability for Harsh Environment Electronics
o Understanding Failure and Root-Cause Analysis in Lead-Free Electronics
o Lead-Free Components
o Understanding of J-STD-020 and J-STD-033 - The impact of PB-Free on Classification and Handling of Moisture-Sensitive ICs Top suppliers will also be showcasing new products and services. For more information about reserving tabletop exhibit space, contact Tina Nerad at +1 847-597-2826 or at TinaNerad@ipc.org . Visit ipc.org/LF1208 to learn more about the conference and to register online. Early bird registration discounts are available until November 5, 2008. About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China. About JEDEC
JEDEC is the leading developer of standards for the solid-state industry. Almost 3,300 participants, appointed by some 295 companies work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.