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Indium Corporation Technology Experts to Present at PCIM Europe

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Indium Corporation

34 Robinson Rd., Clinton, NY, 13323, USA

Original Press Release

Indium Corporation Technology Experts to Present at PCIM Europe

Press release date: May 1, 2014

Indium Corporation technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany.

Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present Void Reduction and Better Thermals with Engineered Flux-Coated Solder Preforms. This paper discusses unique attributes of flux-coated solder preforms and the enhanced manufacturing techniques that achieve consistent, controlled flux coverage over the entire surface of the preform. In all the tests, the flux-coated preforms achieved significantly lower void levels when compared to solder paste.

Eugene Davies, applications engineer, will give a vendor workshop titled Solder TIMs for Superior Thermal Management in Power Electronics. This workshop will discuss indium-containing thermal interface materials developed specifically for high-power applications and their performance compared to thermal grease. Indium Corporation’s patented Heat-Spring®, a foil made of indium and indium-containing alloys, was tested against thermal greases. In all tests, the Heat-Spring® consistently outperformed thermal grease by achieving lower power die temperatures, preventing the power die from overheating. This outcome was achieved by improving thermal interface conductivity (reducing thermal interface resistance), especially over time.

Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally. He earned his master’s degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.

Davies provides application engineering support for Indium Corporation’s solder paste, engineered solder preforms, and thermal management customers in Italy, Spain, Portugal, Malta, Africa, and the Middle East. He earned his master’s degree in Electrical and Electronic Engineering from Newcastle University, UK.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Contact:
Anita Brown, Corporate Communications
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com

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