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Press Release Summary:
March 9, 2012 - Indium Corporation's Technical Manager for Europe, Karthik Vijay, will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland. Karthik will present Engineered Solders in RF & Microwave Packages. This paper discusses how engineering unique attributes into solder preforms exponentially increases the reliability and manufacturing windows of RF and microwave packages. Examples include: Au/Sn solder frames with no trapped oxide or contaminants to achieve a reliable hermetic seal; flux-coated InAg preforms (which melt at 143Â°C) to achieve very low-voiding; and solder-based thermal interface materials that do not require reflow, for superior thermal management. Karthik joined Indium Corporation in 2003. He earned his master's degree in Industrial Engineering with a specialization in Electronics Packaging & Manufacturing from the State University of New York at Binghamton. He is an SMTA-certified engineer and earned his Six Sigma Green Belt certification from Dartmouth College's Thayer School of Engineering. For more information about IMAPS-UK RaMP RF and Microwave Packaging workshop, visit uk.imapseurope.org. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoilÂ®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email email@example.com.
Original Press Release
Indium Corporation Technology Expert to Present at IMAPS-UK RaMP RF and Microwave Packaging Workshop
Press release date: March 8, 2012