Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability
Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13Â - 14 in Costa Mesa, California.
Dr. Ning-Cheng Lee, Vice President of Technology, will present Challenges for Migration toward Low Temperature Lead-Free Soldering. This presentation reviews the joint mechanical strength, drop test performance, and voiding performance of BGAs assembled with SAC105, SAC305, and BiSnAg.
Dr. Ron Lasky, Senior Technologist, will present Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing. This presentation explores how the Weibull function is used to analyze failure data in electronics assembly. Lasky’s presentation will include several case studies that involve multiple failure modes and early first fails.
Joe Bahou, Technical Sales Support Engineer for the West Coast USA, will present Specialty Low Temperature and Low Lead Solders. This presentation will discuss the advantages of bismuth-based alloys for low temperature Pb-free soldering.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Bahou provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and alloy fabrications to Indium Corporation’s customers on the west coast of the USA. He has more than 16 years of experience in electronics assembly manufacturing, including hands-on experience in SMT production. Bahou is a Six Sigma Green Belt and has a bachelor’s degree in mechanical engineering from the University of Massachusetts in Lowell, Mass.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Contact:
Anita Brown, Corporate Communications
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com Â
