Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.

Dr. Mackie’s presentation, Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications, will review changes foreseen for the automotive industry, their impact on electronics in automotive manufacturing, and how materials suppliers are rising to meet these challenges. Topics will include challenges that materials suppliers face when developing and testing materials for the automotive semiconductor assembly industry; high-temperature, Pb-free solder paste for die-attach in discrete components and modules; sintering materials for die-attach for wide-band gap (GaN and SiC) devices; and controlling bondline thickness in IGBT module die-attach using solder preforms.

Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Contact:

Anita Brown,

Corporate Communications

Indium Corporation

abrown@indium.com

Tel: +1.315.381.7524

34 Robinson Road

Clinton, NY 13323 USA

www.indium.com

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