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Henkel to Share Materials Expertise at Upcoming IPC Midwest and SMTA International Events

Original Press Release

Henkel to Share Materials Expertise at Upcoming IPC Midwest and SMTA International Events

Press release date: September 17, 2007

Irvine, California, September 17, 2007 Henkel to Share Materials Expertise at Upcoming IPC Midwest and SMTA International Events At the forthcoming IPC Midwest and SMTA International electronics events, Henkel will not only showcase its latest materials innovations, but will also use each opportunity to share its vast materials knowledge base with show delegates. Top Henkel research and applications staff will present the company's latest findings and insight into new, process-enabling materials developments. At both shows, Henkel's complete line of PCB assembly value chain materials solutions - from Chipbonder® adhesives through to the latest Multicore® lead-free solder pastes - will be on display. One of the company's most innovative materials, Loctite® 3536 CSP underfill, is certain to garner much interest. A lead-free capable material, Loctite® 3536 delivers improved reliability for modern BGA and CSP devices. As these packages are commonly used in handheld products, they are often subjected to stresses such as shock, drop and vibration. Loctite 3536 offers excellent protection against these adverse conditions, offering superior performance as compared to competitive materials. Testing of the material to JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices has shown that Loctite 3536 offers five times the reliability over non-underfilled Pb-free devices. Another highlight of the Henkel booths will be the company's portfolio of lead-free solder pastes. Though the industry is well underway with lead-free manufacturing, certain challenges still remain. Henkel recognizes these issues and has developed a complete line of lead-free materials designed to optimize modern production processes. Experts will be on hand to discuss the company's low-voiding lead-free Multicore® solder paste materials, next-generation Pb-free compatible underfill systems including the inventive Cornerbond(TM) and Edgebond(TM) technologies, as well as the latest flux advances. After visiting the Henkel team at their stand at SMTA International event, attendees are encouraged to receive more in-depth information from the material leader's top technical staff. Well-known industry expert, Dr. Brian Toleno, will take part in a panel discussion focusing on thermal management of today's smaller, faster and hotter products. "The Heat is Off" session, sponsored by Pennwell Publishing, is scheduled at 10:00 on Tuesday, October 9th. Another notable Henkel researher, Renzhe Zhao, Ph.D. will deliver a presentation entitled "Lead-free Application of Flip-Chip Underfills" on October 10th at 3:30 p.m. Findings on the company's work regarding underfills and flux compatibiity will be addressed. At IPC Midwest in Schaumburg, Illinois, Henkel will exhibit from booth # 811 over September 26, 27 and 28. The company's SMTA International booth # is 604. The show will take place from October 9-10 at the Gaylord Palms Conference Center in Orlando, Florida. For more information on Henkel's presence at these events or to speak to a technical expert regarding the company's leading materials solutions, call 949-789-2500 or log onto About Henkel For more than 130 years, Henkel has been a leader with brands and technologies that make people's lives easier, better and more beautiful. Henkel operates in three business areas - Home Care, Personal Care, and Adhesives Technologies - and ranks among the Fortune Global 500 companies. In fiscal 2006, Henkel generated sales of 12.740 billion euros and operating profit of 1,298 million euros. Our 52,000 employees worldwide are dedicated to fulfilling our corporate claim, "A Brand like a Friend," and ensuring that people in more than 125 countries can trust in brands and technologies from Henkel. Contact Henkel Corporation Doug Dixon Phone: 949-789-2500 Fax: 949-785-2595


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