Henkel Steals the Show at ATExpo 2006
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Four paper presentations, a jam-packed booth and a prestigious award win clearly gave Henkel "star of the show" status at last week's ATExpo event, held in Rosemont, Illinois' Donald E. Stephens Convention Center.
Without question, the hottest topic at the show was lead-free manufacturing. Even though the RoHS compliance deadline has come and gone, many challenges with Pb-free production still remain. Henkel materials expert, Dr. Brian Toleno, presented several papers at the event, one of which focused in on the use of next-generation underfills for enhanced reliability of lead-free devices. The company's research has shown that the reliability of lead-free solder joints, which are by nature more brittle and prone to cracking especially when subjected to shock, drop and vibration stresses, can be dramatically improved through the use of specially formulated underfill systems.
"We are definitely seeing more interest in the use of underfills for shock and drop protection as opposed to the issues previously surrounding thermal cycling reliability," states Dr. Brian Toleno, Applications Engineering Team Leader for the electronics group of Henkel. "Whereas underfills are used very heavily at the package level for various reasons, the incorporation of lead-free manufacturing and the influence of the mobile device market now necessitates the use of underfills at the board level to enhance the reliability of CSP and BGA devices manufactured in a Pb-free environment."
The company's innovative work in underfill development for lead-free reliability enhancement has clearly been recognized by the industry, as Henkel's Loctite® 3549 underfill material was honored with a Global Technology Award at last week's event. .The awards program, hosted by Trafalgar Publications, judges product entries based on their outstanding contributions to the semiconductor packaging and electronics assembly markets.
Throughout the three-day exhibition, Henkel's booth was crowded with visitors anxious to learn about the materials leader's modern manufacturing solutions and latest materials developments. Lead free solder paste Multicore® LF328 and cross-over solder paste materials Multicore MP218 were of particular interest, as was the company's latest work on underfill development and its simple, one-step Macromelt encapsulation process.
"By all accounts, this year's Assembly Technology Expo and SMTAI conference were an overwhelming success for Henkel," says Doug Dixon, Global Marketing Manager for the company's electronics group. "The chance to speak with customers one-on-one about their materials requirements combined with the opportunity to share our latest research and development findings was tremendous. Winning the coveted Global Technology Award was just icing on the cake."
For more information on Henkel's complete line of lead-free materials, log onto www.electronics.henkel.com or call the company's Irvine, California headquarters at 949-789-2500.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics industry.
Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Contact
Doug Dixon
Henkel Corporation
Phone: 949-789-2500
Fax:949-785-2595
doug.dixon@us.henkel.com
www.electronics.henkel.com
