Experts Discuss Bottom Termination Components during conference.
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Press Release Summary:
Jointly announced by IPC and SMTA, High-Reliability Cleaning and Conformal Coating Conference will take place November 18–20, 2014 in Schaumburg, IL. Sessions will include “Bottom Termination Components,” “Design Rules that Reduce Flux Pooling under Component Terminations,” “The Risk of No-Clean Flux not Fully Reacted under Component Terminations,” and “Minimum electrical spacing for no-clean flux residue vs cleaned boards (voltage leakage or electro-chemical migration).”
Original Press Release:
Experts to Discuss Bottom Termination Components during the IPC and SMTA High-Reliability Cleaning and Conformal Coating Conference
ROSEMONT, IL — Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois. The conference intensely focuses on best practices and new innovative technologies for meeting today’s manufacturing challenges and producing reliable hardware.
Bill Vuono of TriQuint Semiconductor will chair Session #4 “Bottom Termination Components”
Dale Lee of Plexus Corp. will present on “Design Rules that Reduce Flux Pooling under Component Terminations.”
Dr. Ning Chen Lee of Plexus Corp. will present on “The Risk of No-Clean Flux not Fully Reacted under Component Terminations.”
Dr. Mike Bixenman of Kyzen Corporation with Linda Woody of Lockheed Martin and Dale Lee of Plexus will present on “Minimum electrical spacing for no-clean flux residue vs cleaned boards (voltage leakage or electro-chemical migration).”
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
The link http://www.ipc.org/calendar/2014/cleaning-coating-Nov2014/agenda.htm provides a detail agenda of the topics and speakers.
Web site: www.ipc.org or www.smta.org
