Easy to Apply Form-in-Place Thermal Gap Filler
Carteret, NJ - Tuesday, August 22, 2017 - SARCON® SPG-20A from Fujipoly® is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0 W/m°K and a thermal resistance of only 2.1°K•cm2/W. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely fills unwanted gaps as small as 0.08mm. This allows for more efficient transfer and dissipation of heat from the component and improved performance.
Due to its superior handling properties, SPG-20A is an excellent alternative to thermal grease. The form-in-place silicone material requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C).
About Fujipoly® America Corporation
Fujipoly® America Corporation is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. An ISO9001:2008 registered company, Fujipoly® America Corporation specializes in the fabrication of silicone rubber technology. It is a leader in the areas of Zebra® elastomeric connectors, Sarcon® thermal interface materials, fusible tapes, and custom silicone rubber extrusions. Fuji Polymer Industries Co., Ltd., has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company’s North American operations are based in Carteret, New Jersey. For more information, call (732) 969-0100 or visit us on the Web at http://www.fujipoly.com.
Fujipoly® Contact:
Frank Hobler
Fujipoly® America Corporation
732-969-0100
