Dow Corning Presents Sealants Solutions at Assembly Technology Expo 2006
MIDLAND, Mich. - September 15, 2006 - Steve Block, Dow Corning Technical Manager for Performance Adhesives and Sealants, will present a paper on applications for silicone reactive hot melts at the Assembly Technology Expo 2006 in Chicago, IL on September 27, 2006.
The paper will focus on specific applications for silicone reactive hot melts with plastics. "Most adhesives show poor wetting on plastic substrates and require flame, plasma or corona treatments prior to bonding," said Block. "Newly developed reactive hot melt sealants present a unique opportunity for manufacturers, particularly for bonding plastics."
The presentation will explore the performance characteristics of hot melt sealants and provide examples new and expanded commercial applications related to plastics bonding.
Block has held positions in manufacturing, product development, application engineering and strategic business development during his 21 years at Dow Corning. He has a bachelor of science in Chemical Engineering from the University of Missouri at Rolla and a master of science in Engineering Management from Wichita State University.
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