Douglas Pauls elected to chair IPC TAEC.
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Press Release Summary:
Douglas Pauls of Rockwell Collins will chair IPC Technical Activities Executive Committee for 2-year term. Presently, Pauls is General Chairman of IPC's Cleaning and Coating Committees and has led IPC efforts in bare board cleanliness, solder mask, surface insulation resistance, chemical characterization, conformal coating, and materials and process compatibility testing. He has also served as U.S. representative to ISO and IEC working groups on SIR and electromigration reliability standards.
Original Press Release:
Douglas Pauls Elected to Chair IPC's Top Standards Development Leadership Committee
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC's top standards development oversight committee for the past two years.
"I look forward to this opportunity to serve an organization that has done so much for me and my career," says Pauls. "I am fortunate to have had excellent examples of leadership from former TAEC chairs to emulate."
Pauls has served as an active volunteer and leader for IPC and the electronics manufacturing industry for many years. Presently, he is the General Chairman of IPC's Cleaning and Coating Committees and has led IPC efforts in bare board cleanliness, solder mask, surface insulation resistance (SIR), chemical characterization, conformal coating, cleaning processes, and materials and process compatibility testing. In addition, he has served as a U.S. representative to ISO and IEC working groups on SIR and electromigration reliability standards. He has also participated in numerous national and international consortia on electronics manufacturing materials and processes.
Esteemed by his colleagues for his extensive knowledge and expertise in investigations on materials properties, troubleshooting and optimizing electronics manufacturing processes, failure analysis, environmentally conscious manufacturing, manufacturing residue analysis, SIR testing, adhesives and conformal coatings, Pauls is just as admired for his wit and humor.
"Doug is one of IPC's most prolific writers of IPC documents, but it is well known that his drafts have to be checked closely for zany comments," admits Dave Torp, IPC vice president of standards and technology. "He keeps us on our toes, but his humor is a gift that brings people together and keeps us smiling even through the tough times."
Pauls joined Rockwell Collins in Cedar Rapids, Iowa in 2000 and received the company's Arthur A. Collins Engineer of the Year award in 2004. As a principal materials and process engineer in Advanced Operations Engineering at Rockwell Collins, he works on troubleshooting current manufacturing processes and development of new materials and processes. Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisc., and a B.S. in electrical engineering from the University of Wisconsin, Madison.
Known to have a pathological fear of free time, he enjoys woodworking, woodcarving, and occasionally sneaks away to do some hunting and fishing. Pauls has been happily married for 26 years and has three children.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
