Original Press Release
IPC Conferences to Help Companies Understand Environmental Requirements and Engineer for Compliance, Reliability and Performance
Press release date: August 24, 2009
BANNOCKBURN, Ill, USA, August 24, 2009 - Global, regional and local environmental regulations; conflict metals restrictions; lead-free alloys and solder reliability; nano materials - the issues impacting every link in the electronics manufacturing supply chain are seemingly endless and evolving rapidly. For companies ill-prepared to address these issues, the impact can be costly. To help companies understand the issues, assess their options, achieve compliance and meet customers' demands, IPC - Association Connecting Electronics Industries® is hosting two timely conferences in one convenient location - "It's Not Easy Being Green: Complying with Changing Global Environmental Laws," on November 10, 2009, and "IPC Materials Conference: Engineering for Compliance," on November 11, at the Marriott Hotel in Irvine, Calif.
"Understanding compliance requirements is really just the beginning of a long process with some tough choices to make along the way," says Dave Torp, IPC vice president of standards & technology. "The ultimate goal is to design and manufacture for compliance while improving product reliability and performance ... and we're bringing together the thought leaders from all segments of the industry to help attendees determine the best routes for their companies."
Steve Andrews, the United Kingdom's representative to the EU's RoHS Technical Advisory Committee will lead off the "It's Not Easy Being Green" compliance conference on November 10 with an overview of the EU Commission's ongoing revisions to the RoHS Directive. Presentations by key industry experts will follow, offering critical updates on global environmental regulations and trends, including REACH, China RoHS and green chemistry. Afternoon highlights include halogen-free electronics, conflict metals restrictions and the tools available to help companies measure their eco-environmental impact.
The Materials Conference on November 11 will feature comprehensive sessions examining performance and reliability issues related to halogen-free laminate and lead-free alloys. A "dream team" comprising Jean-Paul Clech, Ph.D., principal, EPSI; Ron Lasky, Ph.D., senior technologist, Indium; and Greg Henshall, Ph.D., senior reliability engineer, Hewlett-Packard, will discuss the challenge and status of lead-free alloy proliferation.
For attendees wanting more in-depth information, an afternoon workshop on November 9 will offer a primer on the European Union's Registration, Evaluation, Authorisation and Restriction of Chemical Substances (REACH) regulation. Lead by Michael Kirschner, president of Design Chain Associates, this workshop will serve as an introduction and background to the REACH update being presented during the full-day technical conference the following day. At morning workshops on November 12, attendees will have an opportunity to delve further into lead-free solder properties and their impact on reliability and explore the properties and potential future applications of nanotechnology.
For more information on the two conferences, visit IPC.org/Compliance-Materials-Conference. To register for one or both conferences, go to IPC.org/Compliance-Materials-Register or call +1 847-597-2861. Inquiries on conference sponsorship opportunities should be directed to Laurie Delfosse, IPC professional development coordinator, at LaurieDelfosse@ipc.org or +1 847-597-2877.
About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.