Beckhoff Automation Promotes Industry 4.0 to the Packaging Industry at Pack Expo 2014
Demos showing Google Glass™ in packaging automation to highlight Beckhoff and Matrix Packaging Machinery booths
SAVAGE, Minnesota – Continuing support of the Industry 4.0 movement, Beckhoff Automation will demonstrate leading-edge packaging automation concepts at the Pack Expo trade show, November 2 – 5, 2014 in Chicago's McCormick Place. Beckhoff's PC-based control technology represents a feature-filled toolbox to implement Industry 4.0 automation solutions in packaging applications. These include the Internet of Things (IoT), cloud computing, highly-centralized packaging automation systems, and ever-more connected devices via open technologies such as EtherCAT and OPC UA.
As a set of flexible tools and a framework to implement such big ideas in the packaging industry, PC-based control technology has become the leading standard to turn visionary Industry 4.0 concepts into profitable 'smart factories'. In booth N-4740 (North Hall), Beckhoff will exhibit a range of innovative packaging solutions, including a demo that highlights the use of Google Glass™ in packaging automation, all-in-one robot and machine control, and open OPC UA connectivity solutions with built-in data security.
Industry 4.0 meets Google Glass™ in the Beckhoff and Matrix Packaging Machinery booths
Beckhoff is featuring a Google Glass™ technology study at Pack Expo 2014. In a demo collaboration with a customer, Beckhoff and Matrix Packaging Machinery (part of the Pro Mach Group of companies, booth N-5321) will connect Google Glass™ to a vertical form / fill / seal machine in the Matrix booth. This illustrates the openness of Beckhoff PC-based control hardware and TwinCAT automation software.
These exciting demos highlight Google Glass™ as an enabling concept for packaging machine operation in an Industry 4.0 framework. The 'augmented reality glasses,' primarily developed for the consumer market, integrate a heads-up display for information as well as a digital camera among numerous other features. As demonstrated by Beckhoff and Matrix Packaging Machinery, Google Glass™ can also be used in industrial environments as a 'wearable HMI' for packaging machine operation and plant production observation.
New CX5100 expands Beckhoff family of Embedded PCs with multi-core processors
Pack Expo 2014 will feature the North American debut of the new CX5100 Embedded PC series from Beckhoff. Via the introduction of the latest Intel® Atom™ CPUs (Bay Trail), multi-core technology is now even more scalable with CX controllers in the medium performance class. The 22-nm technology of the new Atom™ processors results in higher performance while still maintaining the same excellent thermal reduction characteristics. All devices from the CX5100 series are fanless, characterized by low power consumption and a compact, durable metal housing. The CX5100 controllers are available with a choice of three processors: 1.46 GHz (single-core), 1.75 GHz (dual-core) and 1.91 GHz (quad-core). As with all Beckhoff PC-based controllers, the CX5100 Embedded PCs can be used as an OPC UA client or server.
Servo system with One Cable Technology for the smallest packaging machine footprints
An additional highlight from Beckhoff at Pack Expo 2014 will be the introduction of an expanded selection of small servomotors. The new AM811x and AM801x servomotors feature a scalable output of 50 to 250 W, absolute encoders with 15 bit resolution, and One Cable Technology for space-constrained applications. Three overall lengths and an optional backlash-free permanent magnet holding brake make these motion control components ideal for many of the most demanding installations. In combination with the ultra-compact EL72xx servo terminals, packaging machine builders have more options than ever to implement inexpensive, yet robust, servo systems. The new EL7211 extends the product range of these servo drives, boasting performance up to 4 A RMS at 50 V DC.
Robust stainless steel automation solutions in food-grade designs
Beckhoff offers a complete stainless steel control solution in food-grade design for the food, beverage, and pharmaceutical industries. The stainless-steel Control Panel displays and Panel PCs with gap-free housing designs and flush-fitting touchscreens are available in the following display sizes: 12, 15 or 19 inches. The washdown-resistant stainless-steel servomotors in the AM8800 series are designed for standstill torques from 1 to 16.7 nm. In addition, the stainless steel I/O modules with EtherCAT interfaces are also washdown-friendly, offering IP 69K protection, covering a broad range of applications for all common signal types.
For more information:
Beckhoff Automation at Pack Expo
Matrix Packaging Machinery
Beckhoff Automation is a provider of advanced and open automation solutions based upon proven technologies for customers to implement high performance control systems faster and at a lower overall cost than traditional PLC and motion control systems. Beckhoff's "New Automation Technology" product range includes PC-based control, industrial PCs, automation controllers, operator interfaces, I/O, servo drives and motors. With representation in more than 60 countries, Beckhoff is well-positioned to provide global sales and service to its customers. Beckhoff sales and service are handled directly, with no intermediaries involved for exceptional customer service and consultation.
Please send readers' questions regarding "Beckhoff Automation at Pack Expo 2014" to:
Beckhoff Automation LLC
13130 Dakota Ave
Savage, MN 55378
Toll-free: 1-877-TwinCAT
Local: 952-890-0000
Fax: 952-890-2888
email: beckhoff.usa@beckhoff.com
www.beckhoffautomation.com
Media contact:
Shane Novacek
Beckhoff Automation
Phone: 952-808-6515
s.novacek@beckhoff.com
