ARPAC-Hefestus Invites You to the Process Expo 2010 Show, Booth # 12028!
ARPAC - Hefestus USA will feature its SLB(TM) Shelf Life Booster, an innovative technology for extending shelf-life of sealing trays with modified atmosphere (MAP) technology at the Process Expo Show, Booth # 12028, located at McCormick Place in Chicago, July 18 -20, 2010.
SLB(TM) uses no vacuum yet it can achieve Oxygen residual levels of less than 1% and does it faster than current MAP systems. This innovative new packaging technology is therefore safe for any food product and can increase shelf life of these products!
Prolonged shelf life will provide you with maximum efficiency in the supply chain, save in spoilage and will significantly improve your profitability as a producer and supplier of food products. ARPAC - Hefestus offers a variety of packaging solutions which are cost effective, simple to operate and can be set up in under 10 minutes. A variety of packaging machines are available and will be demonstrated at the Process Expo Show, Booth # 12028!
For more information on this State of The Art solution, please contact us at info@arpachefestus.com or 847-678-9034.
We look forward to meeting you at the Process Expo Show in Chicago, Booth # 12028!
About ARPAC- Hefestus
ARPAC-Hefestus USA is a joint venture between ARPAC LP of Schiller Park, Illinois and Hefestus Ltd. of Cesaria, Israel. Hefestus Ltd. was established in 1993 and is a leading manufacturer of Modified Atmosphere Packaging (MAP) systems using a unique and internationally patented technology called Shelf Life BoosterTM (SLBTM). Hefestus Ltd. has hundreds of successful installations throughout Israel, Europe, Asia and Africa.
ARPAC LP is a leading manufacturer of end of line packaging machinery based in Schiller Park, Illinois The ARPAC product line consists ofShrink bundling, shrink wrapping, corrugated tray and case packers and erectors and a full line of automatic and semi-automatic stretch wrap systems.
ARPAC and Hefestus have teamed up to form ARPAC-Hefestus USA to bring the SLBTM Modified Atmosphere Packaging technology to North America. All ARPAC-Hefestus MAP systems have been re-engineered for the US market and will be manufactured at the ARPAC facility in SchillerPark. ARPAC-Hefestus will also service and support every installation from Chicago and through a growing network of qualified packaging distributors.
ARPAC Hefestus USA LLC
info@arpachefestus.com
www.arpachefestus.com
