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VIA Brings Fishbone Video Wall to ESEC Japan 2014

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VIA Technologies, Inc.
8F, 533, Chung-Cheng Rd.
Taipei, Taiwan



Press release date: May 13, 2014

Full range of multiscreen video walls and embedded solutions for powering the Internet of Things to be on display

Taipei, Taiwan — VIA Technologies, Inc, today announced it will be showcasing the latest VIA digital signage solutions together with VIA Embedded boards and systems which are driving the next wave of IoT innovations at the upcoming Embedded Systems Expo Conference (ESEC) 2014, in the Tokyo Big Sight, booth West 5-47, this May 14th - 16th.

Visitors to the VIA booth will be treated to an impressive range of VIA digital signage solutions including a six panel VIA Fishbone architectural video wall, powered by a VIA MW Series video wall controller and VIA MagicView™ content management software. Also on display will be a host of Android and Windows based VIA media players capable of driving smaller signage installations as well as a VIA tablet solution designed for mobile signage applications.

For visitors interested in developing innovative IoT solutions, the VIA Smart Garden demo will be featured, which is a small VIA Springboard controlled garden utilizing Android and a host of sensors and other peripherals in order to automate the maintenance of the garden. Another key embedded demo is a secure M2M gateway developed with our partner utilizing Axeda software running on a ruggedized VIA AMOS-820 system.

"Over the past year we have witnessed a surge in demand for digital signage solutions to address a number of key segments within the Japanese market," said Epan Wu, Head of VIA Embedded Platform Division, VIA Technologies, Inc. "We are excited to have the chance to show off the latest VIA solutions to the market during Japan's famous IT week."

For more information about VIA digital signage solutions, please visit:
http://signage.viatech.com

For more information about VIA Embedded solutions, please visit:
http://www.viaembedded.com

For more information about ESEC 2014, please visit: http://www.japan-it.jp/en/haru/

About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw

VIA PR Contact

International:
Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886)-2-8218-6752
Email: RIBrown@via.com.tw

Note to reporters, editors and writers: VIA is written in ALL CAPS.

The names of actual companies and products mentioned herein may be the trademarks of their respective owners.

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