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Universal Showcases Platform Versatility at Productronica China

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Universal Instruments Corp.

P.O. Box 825, Binghamton, NY, 13902 0825, USA

Original Press Release

Universal Showcases Platform Versatility at Productronica China

Press release date: March 10, 2014

Wide range of capabilities on a standard platform enables manufacturers to easily adapt to changing requirements while minimizing production costs.

Universal Instruments will highlight the industry-leading versatility of its platform portfolio at Productronica China, March 18 – 20, 2014 at the Shanghai New International Expo Centre, SNIEC. Universal will exhibit on the SMT Innovation Point with a team of product experts on-hand to discuss the unique challenges of advanced electronics assembly and automation.

Universal's platform portfolio features the industry's most comprehensive range of capabilities, leveraging an unmatched combination of speed, accuracy and flexibility to extend well beyond standard surface mount and meet the most extreme application challenges. 

"Our platforms continue to evolve to stay ahead of the technology and market curve," said Universal Instruments Vice President of Marketing, Glenn Farris. "From the high-accuracy demands of the advanced semiconductor packaging segment to the flexibility requirements for complex surface mount and odd-form, we have a solution perfectly suited to virtually any production environment."

Universal's platforms handle a full range of surface mount components from 01005 passives to 150mm connectors, while accommodating boards up to 1.3 meters long and supporting up to 272 feeder inputs on a single module.

From the same core technology base, Universal solutions deliver cost-effective, high-accuracy, high-speed assembly for advanced packaging applications including System-in-Package (SiP), Flip Chip, Package-on-Package (PoP), and 2D/2.5D/3D Packaging.

For end-of-line assembly and odd-form placement, Universal's adaptable platform is complemented by a wide range of feeders, nozzles, grippers, and flexible tooling to enable fast and accurate placement of LEDs, connectors, shields, and other large or complex parts. Universal's odd-form solutions reduce costs and maximize yields while eliminating bottlenecks to ensure a continuous production flow.

To learn more about Universal's solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.

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