Universal Demonstrates Newest Platforms at NEPCON China |
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Universal Instruments Corp.
P.O. Box 825
Binghamton, NY, 13902 0825
USA
Press release date: May 5, 2011
Universal Instruments will showcase its newest surface mount and through-hole platforms together with China/Hong Kong-area sales representative Gentron International Limited on booth 1A03 at the 2011 NEPCON China tradeshow in Shanghai, China on May 11-13. The flagship Genesis Series 2 Platform, delivering the ultimate in modular performance for standard-to-extreme surface mount applications, will be showcased. Universal will also feature its Generation 88 through-hole portfolio - building upon the industry-standard for design and reliability to address the growing demands of the industry.
NEPCON China is one of the biggest and longest-standing trading and sourcing platforms for the Chinese SMT industry. This widely respected exhibition is a vibrant showcase for all brands from across the SMT world, where leading electronics manufacturers will display and demonstrate their new products and cutting-edge technologies. It is also where the leaders in brand-building, lead generation and networking for global SMT equipment suppliers gather.
This year's event marks the 21st edition of NEPCON China, and will feature a Green Electronics Pavilion highlighting green solutions for electronics manufacturers.
"With 500 exhibitors from 22 countries and regions, NEPCON China is a global event offering a high level of exposure for our solutions portfolio," comments Brad Bennett, Universal's Vice President of Sales. "We're also really pleased to see the emphasis on green initiatives at this year's show. As the industry moves towards environmentally-friendly technologies, our comprehensive solutions portfolio across every technology segment, including Surface Mount, Through-hole, Odd-form, Final Assembly and Semiconductor, distinguishes Universal from our competition. With our breadth of experience as a solutions integrator in solar, green lighting and power conversion applications, this is an ideal venue for Universal."
Universal's Vice President of Marketing, Debbora Ahlgren, elaborates on Universal's equipment on the booth, "Our Generation 88 through-hole lineup represents the "greenest" machines in the industry, featuring the lowest electric and pneumatic consumption, as well as the only zero-scrap jumper wire." Ahlgren continues, "We're also very happy to be able to introduce our new high-end Genesis Series 2 to the Asian market. We've grown the capabilities of this platform to handle the most complex and extreme assembly challenges, and eliminated the application barriers of traditional surface mount solutions."
The Generation 88 through-hole portfolio is comprised of the Radial 88, VCD/Sequencer 88, and the Single-head Jumper Wire 88. Generation 88 offers an improvement over the previous Generation 8 machines in throughput, functionality, and cost of ownership. Further, it features a new control architecture and operating system for intuitive operation. Generation 88 delivers the speed and robustness to address emergent market segments including LED, compact fluorescent and energy-efficient lighting, as well as power supply and consumer white goods electronics.
The Generation 88 portfolio continues to deliver superior throughput and low PPM levels, while offering flexible, scalable performance with multiple configurations and board handling options. The Genesis Series 2 surface mount platform portfolio includes available 1-, 2-, and 4-beam configurations and three placement head options for throughputs of up to 140,000 cph. Series 2 features a class-leading component range of 01005 passives through 150mm connectors and large overlapping range between placement heads. Further, its ability to place 20mm square, .4mm-pitch uBGAs; QFNs; high-density, low-profile connectors, and tightly spaced 01005s make it well-suited for tablet and smart phone production. Genesis Series 2 is well-suited for extreme applications, including odd-form and large board, making it the industry's most versatile and capable platform.
Genesis Series 2 offers a number of improvements over the previous Genesis Platform. The line-to-line throughput has been increased by 20%. Vision capabilities have been enhanced to process multiple field-of-view components two to three times faster. Board size capability has been increased by 40%, up to 1016mm long. The Lightning® Head now offers an available Vertical Part Sensor (VPS) to verify part presence and position on the spindle prior to placement. Additionally, the Dimensions DPO software line balance and optimization tools have been improved to yield up to a 10% improvement in throughput.
About Gentron International Limited: Gentron International Limited, established in 1998, is a professional total solutions supplier for Surface Mount and Through-hole automation production lines, semiconductor manufacturing and solar cell manufacturing. Gentron now stands as the leading representative in China for world-class equipment from the United States, Germany, Belgium, Switzerland and Israel. Gentron provides total solutions including best-in-class production equipment and process optimization support to deliver comprehensive, value-added services that meet both the productivity and budget requirements for its customers.
About Universal Instruments: Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, with offices in Europe, Asia, and the Americas.
Universal contact Jeffrey Zopff Universal Instruments Corporation 33 Broome Corporate Parkway Conklin, NY 13748 USA Tel: +1 607 779 5364 Email: zopff@uic.com www.uic.com
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