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Universal Brings Award-Winning Fuzion to SMT Nuremberg

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Universal Instruments Corp.

P.O. Box 825, Binghamton, NY, 13902 0825, USA

Original Press Release

Universal Brings Award-Winning Fuzion to SMT Nuremberg

Press release date: May 2, 2014

Versatile platform portfolio extends capabilities to deliver cost-effective performance for a full range of application challenges

Universal Instruments will display its FuzionĀ® Platform at the SMT Hybrid Packaging trade show May 6–8 at the Exhibition Centre Nuremberg in Germany. Universal is exhibiting on Hall 7 Stand 7 – 219 in cooperation with its channel partner, smartTec GmbH.

On the show stand, Universal will highlight the FuzionXC2-37™, winner of Circuits Assembly magazine's NPI Award and the Global SMT & Packaging Global Technology Award last year. With the industry's highest feeder capacity, FuzionXC2-37 enables manufacturers to minimize setups and simply change programs for product changeovers—a streamlined model that can boost utilization, OEE and overall output by 50%, or eliminate entire production shifts.

"FuzionXC™ has proven an excellent fit for the higher-mix European environment, with many manufacturers in the region already leveraging the Fuzion model to enjoy substantial productivity gains," said Universal Instruments Vice President of Marketing, Glenn Farris. "Moreover, our comprehensive Fuzion portfolio, which features up to 140,000 cph on a single module, has enabled that same level of success for high- and medium-volume manufacturers across a range of markets," he added.

Universal recently bolstered the Fuzion lineup with the launch of FuzionOF™ – the fastest and most versatile high-speed automation platform. FuzionOF transforms back-end assembly into a competitive advantage with the highest available odd-form automation throughput and the ability to handle a diverse range of pin-in-paste odd-form, surface mount odd-form, standard surface mount, and semiconductor applications.

"Back-end processes can often act as a bottleneck that restricts productivity while negatively impacting yield and cost," said Farris. "FuzionOF gives manufacturers an economical and flexible back-end solution that will shorten cycle times and facilitate an easy transition to new product challenges while maintaining consistent production rates," he added.

To learn more about Universal Instruments Europe, please contact: Universal Instruments – Koen Vinck, area general manager, +32 331 49540 or vinckk@uic.com; smartTec – Frank Wiethüchter, sales director and co-owner, +49 163 5006213 or fw@smarttec.de.

Jeff Zopff
Global Marketing Communications Manager
Universal Instruments Corporation
Innovation in Electronics Assembly
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