Test Devices Inc. to Exhibit State-of-the-Art Testing Solutions Including Dynamic Spin, Advanced Spin and Dynamic Thermal Mechanical Fatigue Testing at Turbo Expo 2010 |
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Test Devices, Inc.
571 Main Street
Hudson, MA, 01749
USA
Press release date: June 8, 2010
At ASME Turbo Expo 2010 (June 15-17, 2010), Test Devices Inc. (TDI) will showcase a host of dynamic spin testing capabilities that are on the leading edge of rotational testing technology.
The company's exclusive Dynamic Spin and Advanced Spin testing services and equipment produce more relevant data under realistic engine conditions. TDI's innovative technologies include:
o Thermal mechanical fatigue (TMF) spin testing
o Dynamic blade excitation (HCF), long resonance dwelling, realistic temperature profiles
o Validation of Goodman Diagrams (dynamic/static stress interaction)
o Detection of cracks in rotating assemblies during Low-Cycle Fatigue (LCF) testing
o Measurement of elastic and plastic component growth at speed
o Thermal Gradient testing (combined radial and axial)
o Dynamic Spin Rigs
WHO: Christine Murner, Vice President of Test Devices Inc. and key TDI engineers will be available to give you the latest news about advancements in state-of-the-art dynamic spin testing technology.
WHERE: Booth 341 at ASME Turbo Expo 2010 at the Scottish Exhibition & Conference Centre, Glasgow, UK
WHEN: June 15-17, 2010 during show hours
Members of the press can schedule an appointment with key executives by contacting:
Franklyn Roth
FM
631-261-2070
franklyn.roth@fm-group.net
or
Christine Murner
Test Devices, Inc.
978-562-4930
christine.murner@testdevices.com
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