TRFA hosts largest annual meeting yet.
Press Release Summary:
After 13% jump in membership in last year, TRFA welcomed 139 attendees to 2008 Annual Meeting in Chicago from September 14-16. In addition to 14 Technical Paper Presentations and Table Top Showcase, attendees enjoyed keynote presentation by Alan G. Miller, PhD on "Advances in Composite Material Technologies for Commercial Aircraft at Boeing;" a World Market Update from meeting chair Mongeluzi; and Regulatory Affairs/REACH Update from Dr. Charles Bartish.
Original Press Release:
TRFA Hosts Largest Annual Meeting Yet
Glen Ellyn, IL-The Thermoset Resin Formulators Association (TRFA), which has posted a 13% jump in membership in the last year, enjoyed a comparable increase in attendance at its 2008 Annual Meeting, September 14-16 at the Hilton Suites/Magnificent Mile in Chicago, Illinois. In all, the association welcomed 139 attendees to this important industry event.
Underscoring TRFA's growth trend, participation in the association's 2008 Table Top showcase, held in conjunction with the Annual Meeting, more than doubled, from 6 exhibitors in 2007 to 16 in 2008. Association leaders are excited by this growth in light of the current economy, but not surprised. Since the association was founded in 2003, TRFA has filled an important industry and marketplace niche bringing together thermoset resin processors, suppliers and other industry professionals.
Newly elected president, Dr. Vinay Mishra, ITW Devcon said, "While we believe that industry participation at our 2008 Annual Meeting is valued, continued involvement in TRFA as a member is crucial to the success of TRFA, the industry, and the future of our individual companies. We also believe that the collective voice and resources of TRFA will contribute to each member company's growth and success."
Rewarding, Efficient Schedule
Meeting Chair Julie
Mongeluzi, North American Marketing Manager, Dow Epoxy, pointed out that association leaders developed an especially rewarding schedule. In addition to 14 Technical Paper Presentations and the Table Top Showcase, attendees enjoyed a keynote presentation by Alan G. Miller, PhD, Director of Technology Integration - 787 Program, Boeing Commercial Airlines, on "Advances in Composite Material Technologies for Commercial Aircraft at Boeing;" a World Market Update from meeting chair Mongeluzi; and a Regulatory Affairs/REACH Update from Dr. Charles Bartish, Air Products & Chemicals.
In another addition, TRFA hosted a presentation by three testing laboratories, -- Bodycote Testing Group, Trace Laboratories, and VTEC Laboratories, Inc. - followed by a panel discussion facilitated by Chris Andreola of Cabot Corporation.
The bottom line for meeting attendees was a wealth of industry information, unparalleled networking opportunities, and a minimal investment of time away from their businesses.
Technical Presentations
As is the case with every TRFA Annual Meeting, the Technical Papers targeting topics represented by the association's market-focused committees, Adhesives & Sealants; Coatings, Civil Engineering and Floorings; Composites and Tooling; and Potting, Encapsulation and Electrical; provide the centerpiece of the presentations. In 2008, the papers included:
o CURE EVALUATION OF INTELIMER® LATENT CURING AGENTS FOR THERMOSET RESIN APPLICATIONS, Michael S. Lowry, Air Products and Chemicals Inc.
o NANOSTRENGTH BLOCK COPOLYMERS FOR EPOXY TOUGHENING, Robert Barsotti, Arkema, Inc.
o FUEL CELL APPLICATIONS, Paul Kozak and Daniel Ramrus, Ballard.
o HEALABLE, SHAPE MEMORY POLYMERS FOR REFLEXIVE COMPOSITES, Thomas Barnell, Cornerstone Research Group, Inc.
o ALTERNATIVES IN TOUGHENING, William Starner, CVC Thermoset Specialties.
o NOVEL EPOXY TOUGHENING FOR COATINGS AND COMPOSITES APPLICATIONS, Rajesh Turakhia, Dow Epoxy Systems.
o INNOVATIVE AMINE CURING AGENTS FOR EPOXY RESINS, David Fernee, Hexion Specialty Chemicals, Inc.
o TAILOR-MADE POLYHEDRAL OLIGOMERIC SILSESQUIOXANE (POSS) MOLECULES FOR THERMOSET RESINS, Bruce X. Fu, Hybrid Plastics, Inc.
o OPPORTUNITIES FOR THERMOSET RESINS IN THE COMPOSITES INDUSTRY, Sanjay Mazumdar, Lucintel
o POLYMER-CLAY NANOCOMPOSITES IN FLEXIBLE PACKAGING APPLICATIONS, Ying Liang, Nanocor, Inc.
o HIGH PERFORMANCE - NANOPARTICLES - ECOFRIENDLY: INNOVATIVE BASE EPOXY RESINS ENABLING A NEW GENERATION OF COMPOSITES, Patrice Lucas, Nanoledge.
o SILICA NANOPARTICLES & RUBBER TOUGHENING - A SYNERGY IN ADHESIVES & COMPOSITES APPLICATIONS, Stephan Sprenger, nanoresins AG, Germany.
o STRUCTURAL STRENGTHENING OF CONCRETE WITH FRP COMPOSITES, Dave White, Sika Corporation.
o GARAMITE® MIXED MINERAL THIXOTROPES - MORE THAN JUST RHEOLOGY, Terry Brennan, Southern Clay Products, Inc.
All TRFA meeting attendees receive a CD with the complete paper presentations. TRFA members can also access all technical papers and presentations on the TRFA Members-Only website. Industry representatives who are not members of TRFA or meeting attendees may purchase the papers on CD by contacting the TRFA office at info@trfa.org or 630-942-6596.
TRFA is comprised of thermoset formulators and fabricators, raw material suppliers, distributors, equipment manufacturers, manufacturer sales representatives of materials or equipment, importers of raw materials or processing or other equipment, consulting firms and academic institutions serving industries which include adhesives, coatings, civil engineering applications, electrical laminates, composites, tooling, castings and moldings. To learn more about TRFA and the 2008 Annual Meeting, please visit the website at www.trfa.org or contact the association at (630) 942-6596.
