TRFA Annual Meeting to feature 16 technical paper presentations.

Press Release Summary:



Thermoset Resin Formulators Association's (TRFA) 2012 Annual Meeting, taking place in Orlando, FL from October 28-30, will feature presentation of 16 technical papers. These presentations further one of TRFA's key objectives: to be "the premier forum to interact and exchange knowledge among formulators and suppliers." Additional technical presentation will be made by winner of TRFA's third annual Excellence in Thermoset Polymer Research Award.



Original Press Release:



TRFA Annual Meeting Features 16 Technical Paper Presentations



Glen Ellyn, IL-When the Thermoset Resin Formulators Association (TRFA) calls its 2012 Annual Meeting to order, October 28-30 at the Royal Pacific Resort in Orlando, Florida, the agenda will feature the presentation of 16 technical papers.

Since its founding a decade ago, TRFA Technical Paper presentations have been essential to achieving one of the association's key objectives, which is to be "the premier forum to interact and exchange knowledge among formulators and suppliers." Traditionally, the papers are selected by each of the TRFA Market-Focused Committees: Adhesives & Sealants; Coatings, Civil Engineering, Flooring; Composites & Tooling; and Potting, Encapsulation, and Electrical. This year, the presentations are:

1. Steve Hackett, 3M Corporation, Carbon Fiber Composites Employing Nano-Silica Filled Matrix Resins
2. Dr. Martin Ebner, AlzChem AG, Curing Agents for Thermosetting Epoxy Resins-Classical and New Ones
3. John Du, BYK USA, Defoamer Mechanism and Selection Process
4. Janos Hajas, BYK-Chemie GmbH, Hyperbranched Polymeric Pigment Dispersant for Epoxy Systems
5. Mike Watkins, Dixie Chemical Company, Inc., Chemistry and Performance of Specialty Epoxy Resins - A Review
6. Rui Xie, Dow Chemical Company, High Performance Epoxy Resins with Improved Processing Characteristics and Thermal Resistance
7. Dr. Rajesh Turakhia, Dow Chemical Company, Development of a New Low Emission Epoxy Curing Agent for Ambient Cure Applications
8. Gerald L. Witucki, Dow Corning Corporation, Next Generation Polysiloxane Hybrids
9. Christopher Howard, Evonik Industries, Novel High Solids Systems Based on Silicone-Epoxy Resins
10. David Dunn, FLD Enterprises Inc., Epoxy Adhesives for Seismic Mitigation
11. Rongpeng Wang, Missouri University of Science & Technology, Vegetable Oil-Based Epoxy/Clay Nanocomposites
12. Michael Bailey, Sartomer USA, LLC, The Versatility of Acrylate Diluents and Modifiers in 2K Amine Cured Epoxy Coatings
13. Professor Robert Lane, Texas A & M University, Epoxy Systems to Plug Damaged Gulf of Mexico Hydrocarbon Wells
14. Dr. Ian McAninch, US Army Research Laboratory, Properties of Epoxy Networks with Bimodal Monomer Distributions
15. Dr. Yuan Chieh Chu, Valtech Corporation, Meeting the Challenges of Photovoltaic (PV) Wafer Manufacturing: New Technology in Temporary Adhesives to Reduce Wafer Chipping
16. Dr. Nagesh Potluri, Zyvex Technologies, Mechanical Properties of Graphene-Epoxy Composites

In the ten years since it was founded, TRFA has established a substantial library of Technical Papers, all of them available on the association's members-only website. In addition to that availability, all TRFA meeting attendees receive a CD with all technical papers presented at the meeting.

An additional technical presentation will be made by the winner of TRFA's third annual Excellence in Thermoset Polymer Research Award, to be announced later this month.

TRFA is comprised of thermoset formulators and fabricators, raw material suppliers, distributors, equipment manufacturers, manufacturer sales representatives of materials or equipment, importers of raw materials or processing or other equipment, consulting firms and academic institutions serving industries which include adhesives, coatings, civil engineering applications, electrical laminates, composites, tooling, castings and moldings. To learn more about TRFA please visit the website at www.trfa.org or contact the association at (630) 942-6596.

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