IPC Summit focuses on succeeding in a disruptive environment.
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Press Release Summary:
Scheduled for Oct 4-5, 2011, IPC Executive Summit is titled "Succeeding in a Disruptive Environment: From Earthquakes to Nanoparticles." Two-day event will include general sessions covering disaster preparedness and strategies for mitigating supply chain disruptions; results of IPC study on impact of Japan earthquake; and perspective on conflict minerals ban. Market and Technology Conference will feature financial analyst's view on agile supply chain and lessons from the great recession.
Original Press Release:
Succeeding in a Disruptive Environment the Focus of IPC Executive Summit
BANNOCKBURN, Ill., USA, - IPC- Association Connecting Electronics Industries® will host the IPC Executive Summit, "Succeeding in a Disruptive Environment: From Earthquakes to Nanoparticles," on October 4-5, 2011, in San Jose, Calif. An event that combines the strategic planning focus of IPC's Management Meetings with the global business insights of its Market & Technology Conference, the IPC Executive Summit will provide ideas and solutions that will help senior-level executives strategically map their companies' futures through today's disruptive climate.
The two-day event features presentations from a who's who of electronics manufacturing experts and leaders in the business community on timely issues impacting the electronics manufacturing industry. On the first day, the general sessions at the management meetings will include a presentation from iSuppli's chief research officer on disaster preparedness and strategies for mitigating supply chain disruptions; the results of an IPC study on the impact of the earthquake in Japan; and an update and industry perspective on the ban on conflict minerals. In addition to the general sessions, concurrent management tracks provide executives at EMS companies, PCB manufacturers and PCB suppliers with focused learning designed to meet their specific needs.
The Market & Technology Conference on the second day features a leading financial analyst's view on the increasingly agile supply chain and lessons from the great recession; a discussion of Intel's technology roadmap and how the semiconductor industry is driving new OEM requirements for interconnect suppliers; Raghu Das of IDTechEx on advances in and new applications for printed electronics technology; and an expert from Dow on how new materials will change the way PCBs are made and perform.
The IPC Executive Summit offers a unique opportunity to network, engage in valuable discussions and share thoughts on industry trends with fellow decision makers across the electronics supply chain.
For more information and to register for IPC Executive Summit, visit http://www.ipc.org/executive-summit.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
