Smart Junction Boxes Use Solderless Compliant Technology for Stringent Class III Under-Hood Automotive Requirements |
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Autosplice
10121 Barnes Canyon Rd.
San Diego, CA, 92121
USA
Press release date: June 20, 2007
San Diego, CA - Autosplice has announced the qualification and widening adoption of compliant interconnects to create solderless connections in Smart Junction Boxes (SJBs) for a variety of demanding under-hood automotive applications. Such under-hood applications generally fall under the Class III USCAR (United States Council for Automotive Research) specifications.
Based on extensive testing and real-world application results, "big three" automotive manufacturers are now actively designing Autosplice's Autopliant(TM) compliant interconnects into a widening range of SJB assemblies. The rugged environmental factors in under-hood automotive applications place stringent demands on interconnections to consistently maintain optimal connection integrity, retention force and high current-carrying capacity.
Compliant interconnects are inserted directly into the PCB to form a "single-step" electrical connection without the need for any subsequent wave, selective or reflow solder processing steps. This reduces both cost and production complexity, which can be especially beneficial for designs with high-amperage, heavy copper layers that have always presented difficult soldering challenges. Additionally, it reduces the number of thermal exposures that the PCB must endure.
Compliant interconnects offer the following key benefits for SJBs: o Automation-friendly solderless assembly o Elimination of inefficient secondary processing o Meets RoHS "lead-free" requirements o Avoidance of cold solder joints, fractured joints and flux contamination o Simplified rework without requiring de-soldering steps o Reduced thermal exposure to the PCB and surrounding components o Gas-tight interconnections o High level of in-board retention force o Excellent current-carrying capabilities o Compatible with industry standard PTH's
Extensive empirical independent lab testing has confirmed that Autosplice's compliant interconnects significantly exceed retention force requirements and maintain a consistent gas-tight fit under extremely adverse conditions. Achieving a gas-tight fit is important for avoiding the degradation of electrical continuity and assuring long-term mechanical integrity of SJB assemblies in harsh under-hood environments.
Key test parameters included thermal shock, mechanical shock & vibration, temperature & humidity cycling, hole conditioning and corrosive mixed flow gas exposure. In order to qualify for high-reliability automotive applications, the AutoPliant components were tested to meet criteria based on following SAE/USCAR2 Revision 4, IEC 60352-5 and EIA Publication 364 specifications.
Autosplice is a leading manufacturer of terminals, component assemblies and applicator systems, providing automated solutions for high-volume electrical interconnections. Autosplice systems enable substantial cost savings and provide superior reliability over conventional connector products and assembly methods.
For More Information: Autosplice, Greg Torigian, Phone 845-942-3931, Email gtorigian@autosplice.com
For more information on Autosplice's products or to discuss unique applications, contact Autosplice at (800) 535-5538 or visit our Web Site at www.autosplice.com
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