ThomasNet Home   |   Promote Your Business
Home  |   My ThomasNet News®  |   Industry Market Trends  |   Submit Release  |   Advertise  |   About Us May 26, 2012  

SUSS MicroTec Test Systems Named Exclusive Supplier of 300 mm Characterization and Reliability Test Solutions

Print | 
Email |  Comment   Share  

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

SUSS MicroTec Inc.
GITC 1-18-2, Hakusan
Yokohama, Japan



Press release date: April 28, 2009

ProbeShield® Technology chosen by major US-based semiconductor manufacturer

DRESDEN, Germany, April 28 2009 - SUSS MicroTec Test Systems has announced that it has once again won a head-to-head evaluation with its unique PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test. The evaluation took place at a major integrated device manufacturer (IDM) located in the United States. As the winner of the evaluation, SUSS MicroTec has been named the exclusive supplier of on-wafer characterization systems for three years and is committed to work diligently in maintaining this position for many years beyond. As expected, the manufacturer has already placed the first system order.

The decision follows a comprehensive, head-to-head comparison against the major suppliers of waferlevel test solutions at the manufacturer's facilities. In the evaluation, all systems were simultaneously compared in the same laboratory using several benchmarks. These consisted mainly of advanced tests of semiconductor devices, such as flicker noise, I-V, C-V and S-parameter measurements, which are used to extract critical parameters in the device design and process control phases. SUSS MicroTec's ProbeShield Technology consistently outperformed the competitive solutions, leading to its ultimate selection.

"The engineers at the manufacturer chose ProbeShield Technology due to the superior positioning accuracy especially on small pads and significant time savings provided by advanced automation features such as ReAlign(TM) Technology for automatic alignment of probe tips to pads after a temperature change," said Rick Dock, Vice President of North American Sales at SUSS MicroTec. "We are very excited about this particular win; it has validated the significance of both measurement accuracy and thermal automation when characterizing devices. This was just one of the many ways SUSS MicroTec demonstrated significant and tangible value when compared to the competition through our superior solutions and worldclass customer support."

About SUSS MicroTec

SUSS MicroTec Test Systems is a subsidiary of SUSS MicroTec AG, which is listed in Deutsche Börse AG's Prime Standard.

SUSS MicroTec is a leading supplier of process and test solutions for markets such as 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership. SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, visit www.suss.com.

Sabine Radeboldt
Corporate Marketing Manager
SUSS MicroTec AG
Sabine.radeboldt@suss.com
+49 (0)89 32007 395
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
Don’t hunt for stories like this.
Let Test & Measuring Instruments
Product News Come to You!
Get a Free Subscription
to Product News Alerts.
Start Your Free
Subscription to
Industry Market Trends.
 See more product news in:
Test and Measuring Instruments
 More New Product News from this company:
Mask Aligners are offered with customized illumination.
Production Mask Aligner suits 3D packaging applications.
Test System offers wafer-level device characterization.
Wafer Bonding System offers single station bonding.
Placement and Bonding System covers range of processes.
More ....
 Other News from this company:
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
SUSS MicroTec Introduces New |Z| Probe® Technology for Wafer-Level RF Testing
SUSS MicroTec Receives Multiple Orders from Nemotek Technologie for Wafer-Level Camera Production to Use in Portable Applications
More ....
 Tools for you
Watch Company 
Company web site
More news from this company
E-Mail Story
Save Story
Search for suppliers of
Semiconductor Testers
Wafer Inspection Systems
Join the forum discussion at:
Tools of the Trade


Home  |  My ThomasNet News®  |  Industry Market Trends  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2012 Thomas Publishing Company
Terms of Use - Privacy Policy



Error close

Please enter a valid email address