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SEHO to Highlight New Process Control Features on the PowerSelective at the IPC APEX EXPO

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SEHO to Highlight New Process Control Features on the PowerSelective at the IPC APEX EXPO
SEHO to Highlight New Process Control Features on the PowerSelective at the IPC APEX EXPO
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SEHO Systems GmbH
Frankenstr. 7 - 11
Kreuzwertheim, 97892
Germany



Press release date: January 1, 2013

KREUZWERTHEIM, GERMANY- SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, will highlight its best-selling selective soldering system - the SEHO PowerSelective in booth #409 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.

The PowerSelective's software ensures high process reliability by compensating product or production-related warpage of the assemblies to be processed. The new software feature available for the PowerSelective guarantees an automated and reliable procedure.

During operation, a high precision laser measuring system determines the actual distance of the PCB from the previously defined points prior to soldering. These values and the z height of the reference point are the basis for a precise calculation for modelling and illustrating an altitude profile for the assembly in process. All points of the soldering program are set off against the modelled value, ensuring that all points are soldered at the optimum height regardless of actual board warpage.

The PCB warpage compensation together with the automatic PCB alignment based on fiducial recognition guarantees optimum and highly reproducible xyz positioning, thus going one step further in zero-fault production.

Absolutely unique is SEHO's AOI feature that can be easily integrated into a PowerSelective, offering remarkable cost savings in floor space and board handling equipment. Depending on the complexity of the products to be soldered, the AOI system can be activated if solder joints are considered to be critical, or it may be deactivated for uncomplicated boards, thus reducing overall production time. While using the AOI system in the production process, the unit allows separation of assemblies with defects and automatically leads them to a repair station instead of returning them into the production line. The AOI system is equipped with a special 5 MP RGB camera and LEDs for lighting in different colors. It provides a field of view of 51 x 38 mm with 20 µm pixel resolution. The software that belongs to the system provides a comprehensive component library to ensure easy programming.

For more information about the SEHO PowerSelective visit www.sehona.com.

About SEHO Systems GmbH
Since its foundation in 1973, SEHO has become the worldwide contact partner whenever soldering is involved. Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO's business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. As a result, all applicable environmental standards are complied with meticulously. With its systems, the company provides customers with a sustained and resource economizing production facility. It continuously develops its technology in order to provide customers with a competitive advantage. For more information, visit www.seho.de.

CONTACT
Heike Schlessmann
SEHO Systems GmbH
E-mail: heike.schlessmann@seho.de
Web Site: www.seho.de
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