Rudolph Launches F30 Advanced Macro Inspection Module |
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Rudolph Technologies, Inc.
1 Rudolph Rd., P.O. Box 1000
Flanders, NJ, 07836
USA
Press release date: April 18, 2011
High throughput, robust capability among key features driving new orders
Flanders, New Jersey -Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, today announced the global launch of the F30(TM) Advanced Macro Inspection Module, further extending the capabilities of the Explorer® Inspection Cluster product line. Multiple F30 Inspection Modules have been purchased in recent weeks, and several are already installed in high-volume semiconductor manufacturing facilities.
"Foundries and IDMs are choosing the F30 Module for several reasons, including its improved throughput over the entire sensitivity range when compared to previous generation tools," said Scott Balak, Rudolph's director of front-end inspection products. "In addition, the hardware platform is capable of supporting 450mm development, and is designed to accommodate future customer requirements and new capabilities."
After a rigorous evaluation and development process, multiple customers have selected the F30 Module, including two European fabs, a leading Asian foundry, a leading MEMS producer, and a process equipment manufacturer that is developing an integrated inspection solution. Each customer had their own specific needs, but all chose the F30 Module for its flexible blend of throughput and detection sensitivity, resulting in a lower CoO.
"We are pleased with the market demand for this new product and the variety of inspection processes our customers have chosen to implement using the F30," Balak continued. "The F30 Module combines automated setup, intelligent software and robust capability-all staged on a flexible platform designed to accommodate additional capability as defined by our customers' changing requirements."
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The company's yield management solutions are used in both the wafer processing and final manufacturing of ICs, as well as in emerging markets such as LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
Contacts:
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com
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